Abstract
In this paper, a wireless power transfer (WPT) scheme using magnetic field resonances for 3D packages is proposed and a wireless power distribution network (PDN) in a WPT system is analyzed in terms of the simultaneous switching noise (SSN). For analyzing the wireless PDN impedance characteristic and the power efficiency, a ball grid array (BGA) package with a size of 35 mmx35 mm is fabricated. Also, a new schematic of the wire PDN is defined to analyze a WPT system applied to the WPT system in terms of SSN. The impedance (Z 11 ) characteristics between the interconnection-based hierarchical PDN structure and the hierarchical PDN based on the proposed WPT scheme are compared and analyzed. The package-level WPT system proposed in this study represents excellent wireless PDN impedance characteristics in decreasing the power noise occurred in a 3D package.
| Original language | American English |
|---|---|
| Journal | Proceedings of the 6th IEEE Electrical Design of Advanced Packaging Systems Symposium (2013, Nara, Japan) |
| DOIs | |
| State | Published - Dec 15 2013 |
Keywords
- 3D Package
- Inductor Design
- Magnetic Field
- PDN-Impedance
- Power Distribution Network (PDN)
- Power Efficiency
- Resonance
- Simultaneous Switching Noise (SSN)
- Wireless Power Transfer (WPT)
Disciplines
- Electromagnetics and Photonics
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