Wafer level embedding technology for 3D wafer level embedded package

Aditya Kumar; Xia Dingwei; Vasarla Nagendra Sekhar; Sharon Lim; Chin Keng; Gaurav Sharma; Vempati Srinivas Rao; Vaidyanathan Kripesh; John H. Lau; Dim Lee Kwong

doi:10.1109/ECTC.2009.5074177

Wafer level embedding technology for 3D wafer level embedded package

Aditya Kumar
, Xia Dingwei
, Vasarla Nagendra Sekhar
, Sharon Lim
, Chin Keng
, Gaurav Sharma
, Vempati Srinivas Rao
, Vaidyanathan Kripesh
, John H. Lau
, Dim Lee Kwong

Agency for Science, Technology and Research, Singapore
Kinergy Ltd
Hong Kong University of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
Pages	1289-1296
Number of pages	8
DOIs	https://doi.org/10.1109/ECTC.2009.5074177
State	Published - 2009
Externally published	Yes
Event	2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States Duration: May 26 2009 → May 29 2009

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2009 59th Electronic Components and Technology Conference, ECTC 2009
Country/Territory	United States
City	San Diego, CA
Period	5/26/09 → 5/29/09

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2009.5074177

Cite this

Kumar, A., Dingwei, X., Sekhar, V. N., Lim, S., Keng, C., Sharma, G., Rao, V. S., Kripesh, V., Lau, J. H., & Kwong, D. L. (2009). Wafer level embedding technology for 3D wafer level embedded package. In 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009 (pp. 1289-1296). Article 5074177 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2009.5074177

Wafer level embedding technology for 3D wafer level embedded package. / Kumar, Aditya; Dingwei, Xia; Sekhar, Vasarla Nagendra et al.
2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. 2009. p. 1289-1296 5074177 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kumar, A, Dingwei, X, Sekhar, VN, Lim, S, Keng, C, Sharma, G, Rao, VS, Kripesh, V, Lau, JH & Kwong, DL 2009, Wafer level embedding technology for 3D wafer level embedded package. in 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009., 5074177, Proceedings - Electronic Components and Technology Conference, pp. 1289-1296, 2009 59th Electronic Components and Technology Conference, ECTC 2009, San Diego, CA, United States, 5/26/09. https://doi.org/10.1109/ECTC.2009.5074177

@inproceedings{282e4de4c41341fe9703109d93132d33,

title = "Wafer level embedding technology for 3D wafer level embedded package",

author = "Aditya Kumar and Xia Dingwei and Sekhar, \{Vasarla Nagendra\} and Sharon Lim and Chin Keng and Gaurav Sharma and Rao, \{Vempati Srinivas\} and Vaidyanathan Kripesh and Lau, \{John H.\} and Kwong, \{Dim Lee\}",

year = "2009",

doi = "10.1109/ECTC.2009.5074177",

language = "English",

isbn = "9781424444762",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "1289--1296",

booktitle = "2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009",

note = "2009 59th Electronic Components and Technology Conference, ECTC 2009 ; Conference date: 26-05-2009 Through 29-05-2009",

}

TY - GEN

T1 - Wafer level embedding technology for 3D wafer level embedded package

AU - Kumar, Aditya

AU - Dingwei, Xia

AU - Sekhar, Vasarla Nagendra

AU - Lim, Sharon

AU - Keng, Chin

AU - Sharma, Gaurav

AU - Rao, Vempati Srinivas

AU - Kripesh, Vaidyanathan

AU - Lau, John H.

AU - Kwong, Dim Lee

PY - 2009

Y1 - 2009

UR - https://www.scopus.com/pages/publications/70349659174

UR - https://www.scopus.com/pages/publications/70349659174#tab=citedBy

U2 - 10.1109/ECTC.2009.5074177

DO - 10.1109/ECTC.2009.5074177

M3 - Conference contribution

AN - SCOPUS:70349659174

SN - 9781424444762

T3 - Proceedings - Electronic Components and Technology Conference

SP - 1289

EP - 1296

BT - 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009

T2 - 2009 59th Electronic Components and Technology Conference, ECTC 2009

Y2 - 26 May 2009 through 29 May 2009

ER -

Wafer level embedding technology for 3D wafer level embedded package

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Conference

ASJC Scopus Subject Areas

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