VLSI JOIN MODULE.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Proceedings of the Hawaii International Conference on System Science
Editors	Lee W. Hoevel, Dayton NCR Corp
Publisher	IEEE
Pages	41-49
Number of pages	9
ISBN (Print)	0818608412
State	Published - 1988
Externally published	Yes

Name	Proceedings of the Hawaii International Conference on System Science
ISSN (Print)	0073-1129

ASJC Scopus Subject Areas

@inproceedings{e94e5b8e24a2470a980773e00a466453,

title = "VLSI JOIN MODULE.",

author = "Hurson, \{A. R.\} and Petrie, \{C. R.\} and Cheng, \{J. B.\}",

year = "1988",

language = "English",

isbn = "0818608412",

series = "Proceedings of the Hawaii International Conference on System Science",

publisher = "IEEE",

pages = "41--49",

editor = "Hoevel, \{Lee W.\} and \{NCR Corp\}, Dayton",

booktitle = "Proceedings of the Hawaii International Conference on System Science",

}

TY - GEN

T1 - VLSI JOIN MODULE.

AU - Hurson, A. R.

AU - Petrie, C. R.

AU - Cheng, J. B.

PY - 1988

Y1 - 1988

UR - https://www.scopus.com/pages/publications/0023859627

UR - https://www.scopus.com/pages/publications/0023859627#tab=citedBy

M3 - Conference contribution

AN - SCOPUS:0023859627

SN - 0818608412

T3 - Proceedings of the Hawaii International Conference on System Science

SP - 41

EP - 49

BT - Proceedings of the Hawaii International Conference on System Science

A2 - Hoevel, Lee W.

A2 - NCR Corp, Dayton

PB - IEEE

ER -