Three dimensional circuit oriented electromagnetic modeling for VLSI packaging

A. Ruehli; H. Heeb

doi:10.1109/APS.1992.221659

Three dimensional circuit oriented electromagnetic modeling for VLSI packaging

A. Ruehli
, H. Heeb

IBM

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	1992 Joint Symposia
Subtitle of host publication	IEEE Antennas and Propagation Society International Symposium - 1992 Digest, AP-S 1992
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1256
Number of pages	1
ISBN (Electronic)	0780307305
DOIs	https://doi.org/10.1109/APS.1992.221659
State	Published - 1992
Externally published	Yes
Event	1992 Joint Symposia Digest: IEEE Antennas and Propagation Society International Symposium, AP-S 1992 - Chicago, United States Duration: Jun 18 1992 → Jun 25 1992

Publication series

Name	IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
Volume	1992-June
ISSN (Print)	1522-3965

Conference

Conference	1992 Joint Symposia Digest: IEEE Antennas and Propagation Society International Symposium, AP-S 1992
Country/Territory	United States
City	Chicago
Period	6/18/92 → 6/25/92

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/APS.1992.221659

Cite this

Ruehli, A., & Heeb, H. (1992). Three dimensional circuit oriented electromagnetic modeling for VLSI packaging. In 1992 Joint Symposia: IEEE Antennas and Propagation Society International Symposium - 1992 Digest, AP-S 1992 (pp. 1256). Article 221659 (IEEE Antennas and Propagation Society, AP-S International Symposium (Digest); Vol. 1992-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APS.1992.221659

Three dimensional circuit oriented electromagnetic modeling for VLSI packaging. / Ruehli, A.; Heeb, H.
1992 Joint Symposia: IEEE Antennas and Propagation Society International Symposium - 1992 Digest, AP-S 1992. Institute of Electrical and Electronics Engineers Inc., 1992. p. 1256 221659 (IEEE Antennas and Propagation Society, AP-S International Symposium (Digest); Vol. 1992-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ruehli, A & Heeb, H 1992, Three dimensional circuit oriented electromagnetic modeling for VLSI packaging. in 1992 Joint Symposia: IEEE Antennas and Propagation Society International Symposium - 1992 Digest, AP-S 1992., 221659, IEEE Antennas and Propagation Society, AP-S International Symposium (Digest), vol. 1992-June, Institute of Electrical and Electronics Engineers Inc., pp. 1256, 1992 Joint Symposia Digest: IEEE Antennas and Propagation Society International Symposium, AP-S 1992, Chicago, United States, 6/18/92. https://doi.org/10.1109/APS.1992.221659

Ruehli A, Heeb H. Three dimensional circuit oriented electromagnetic modeling for VLSI packaging. In 1992 Joint Symposia: IEEE Antennas and Propagation Society International Symposium - 1992 Digest, AP-S 1992. Institute of Electrical and Electronics Engineers Inc. 1992. p. 1256. 221659. (IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)). doi: 10.1109/APS.1992.221659

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author = "A. Ruehli and H. Heeb",

year = "1992",

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language = "English",

series = "IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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ER -

Three dimensional circuit oriented electromagnetic modeling for VLSI packaging

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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