Thermal modeling and characterization of the Embedded Micro Wafer Level Package (EMWLP) at the package- and system-level

Yen Yi Germaine Hoe; Tang Gongyue; Gaurav Sharma; Damaragunath Pinjala; Vempati Srinivasa Rao; Jong Ming Chinq; Sharon Lim Pei Siang; Aditya Kumar; Ho Soon Wee; Zhang Xiaowu; V. Kripesh

doi:10.1109/EPTC.2009.5416560

Thermal modeling and characterization of the Embedded Micro Wafer Level Package (EMWLP) at the package- and system-level

Yen Yi Germaine Hoe
, Tang Gongyue
, Gaurav Sharma
, Damaragunath Pinjala
, Vempati Srinivasa Rao
, Jong Ming Chinq
, Sharon Lim Pei Siang
, Aditya Kumar
, Ho Soon Wee
, Zhang Xiaowu
, V. Kripesh

Agency for Science, Technology and Research, Singapore
United Test and Assembly Center (UTAC)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages	137-145
Number of pages	9
DOIs	https://doi.org/10.1109/EPTC.2009.5416560
State	Published - 2009
Externally published	Yes
Event	2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore Duration: Dec 9 2009 → Dec 11 2009

Publication series

Name	Proceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference	2009 11th Electronic Packaging Technology Conference, EPTC 2009
Country/Territory	Singapore
City	Singapore
Period	12/9/09 → 12/11/09

ASJC Scopus Subject Areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Condensed Matter Physics

Access to Document

10.1109/EPTC.2009.5416560

Cite this

Hoe, Y. Y. G., Gongyue, T., Sharma, G., Pinjala, D., Rao, V. S., Chinq, J. M., Siang, S. L. P., Kumar, A., Wee, H. S., Xiaowu, Z., & Kripesh, V. (2009). Thermal modeling and characterization of the Embedded Micro Wafer Level Package (EMWLP) at the package- and system-level. In EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference (pp. 137-145). Article 5416560 (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/EPTC.2009.5416560

Thermal modeling and characterization of the Embedded Micro Wafer Level Package (EMWLP) at the package- and system-level. / Hoe, Yen Yi Germaine; Gongyue, Tang; Sharma, Gaurav et al.
EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. 2009. p. 137-145 5416560 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hoe, YYG, Gongyue, T, Sharma, G, Pinjala, D, Rao, VS, Chinq, JM, Siang, SLP, Kumar, A, Wee, HS, Xiaowu, Z & Kripesh, V 2009, Thermal modeling and characterization of the Embedded Micro Wafer Level Package (EMWLP) at the package- and system-level. in EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference., 5416560, Proceedings of the Electronic Packaging Technology Conference, EPTC, pp. 137-145, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, Singapore, 12/9/09. https://doi.org/10.1109/EPTC.2009.5416560

Hoe YYG, Gongyue T, Sharma G, Pinjala D, Rao VS, Chinq JM et al. Thermal modeling and characterization of the Embedded Micro Wafer Level Package (EMWLP) at the package- and system-level. In EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. 2009. p. 137-145. 5416560. (Proceedings of the Electronic Packaging Technology Conference, EPTC). doi: 10.1109/EPTC.2009.5416560

@inproceedings{30e6191703274ec88cb6ed692b0a1bca,

title = "Thermal modeling and characterization of the Embedded Micro Wafer Level Package (EMWLP) at the package- and system-level",

author = "Hoe, \{Yen Yi Germaine\} and Tang Gongyue and Gaurav Sharma and Damaragunath Pinjala and Rao, \{Vempati Srinivasa\} and Chinq, \{Jong Ming\} and Siang, \{Sharon Lim Pei\} and Aditya Kumar and Wee, \{Ho Soon\} and Zhang Xiaowu and V. Kripesh",

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doi = "10.1109/EPTC.2009.5416560",

language = "English",

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AU - Hoe, Yen Yi Germaine

AU - Gongyue, Tang

AU - Sharma, Gaurav

AU - Pinjala, Damaragunath

AU - Rao, Vempati Srinivasa

AU - Chinq, Jong Ming

AU - Siang, Sharon Lim Pei

AU - Kumar, Aditya

AU - Wee, Ho Soon

AU - Xiaowu, Zhang

AU - Kripesh, V.

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M3 - Conference contribution

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SN - 9781424451005

T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC

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BT - EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference

T2 - 2009 11th Electronic Packaging Technology Conference, EPTC 2009

Y2 - 9 December 2009 through 11 December 2009

ER -

Thermal modeling and characterization of the Embedded Micro Wafer Level Package (EMWLP) at the package- and system-level

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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