The effect of mechanical vibration on thermally cycled, lead-free and mixed alloy solder joints

Matthew J. O'Keefe; Martin Perez; Ken Doering; Richard Colfax; Dale Murry; Steve Vetter; David Kleine

The effect of mechanical vibration on thermally cycled, lead-free and mixed alloy solder joints

Matthew J. O'Keefe
, Martin Perez
, Ken Doering
, Richard Colfax
, Dale Murry
, Steve Vetter
, David Kleine

Materials Science and Engineering

Missouri University of Science and Technology
Northrop Grumman
Boeing

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007
Pages	776-785
Number of pages	10
State	Published - 2007
Event	IPC Printed Circuits Expo, APEX and the Designers Summit 2007 - Los Angeles, CA, United States Duration: Feb 20 2007 → Feb 22 2007

Publication series

Name	IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007
Volume	2

Conference

Conference	IPC Printed Circuits Expo, APEX and the Designers Summit 2007
Country/Territory	United States
City	Los Angeles, CA
Period	2/20/07 → 2/22/07

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Cite this

The effect of mechanical vibration on thermally cycled, lead-free and mixed alloy solder joints. / O'Keefe, Matthew J.; Perez, Martin; Doering, Ken et al.
IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007. 2007. p. 776-785 (IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

O'Keefe, MJ, Perez, M, Doering, K, Colfax, R, Murry, D, Vetter, S & Kleine, D 2007, The effect of mechanical vibration on thermally cycled, lead-free and mixed alloy solder joints. in IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007. IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007, vol. 2, pp. 776-785, IPC Printed Circuits Expo, APEX and the Designers Summit 2007, Los Angeles, CA, United States, 2/20/07.

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title = "The effect of mechanical vibration on thermally cycled, lead-free and mixed alloy solder joints",

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year = "2007",

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booktitle = "IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007",

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T1 - The effect of mechanical vibration on thermally cycled, lead-free and mixed alloy solder joints

AU - O'Keefe, Matthew J.

AU - Perez, Martin

AU - Doering, Ken

AU - Colfax, Richard

AU - Murry, Dale

AU - Vetter, Steve

AU - Kleine, David

PY - 2007

Y1 - 2007

UR - https://www.scopus.com/pages/publications/84866897151

UR - https://www.scopus.com/pages/publications/84866897151#tab=citedBy

M3 - Conference contribution

AN - SCOPUS:84866897151

SN - 9781604237863

T3 - IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

SP - 776

EP - 785

BT - IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

T2 - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

Y2 - 20 February 2007 through 22 February 2007

ER -

The effect of mechanical vibration on thermally cycled, lead-free and mixed alloy solder joints

Publication series

Conference

ASJC Scopus Subject Areas

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