Skip to main navigation Skip to search Skip to main content

The Design of a Lumped Element Impedance-Matching Network with Reduced Parasitic Effects Obtained From Numerical Modeling

  • Shaofeng Luan
  • , Jun Fan
  • , James L. Knighten
  • , Norman W. Smith

Research output: Contribution to journalArticlepeer-review

Abstract

This paper presents an impedance-matching network design with numerical modeling of the parasitic effects. A modeling tool CEMPIE (a Circuit Extraction approach based on a Mixed Potential Integral Equation formulation) is used to model the hoard-level parasitics of surface mount technology (SMT) resistors for impedance-matching networks. A 3-layer design of impedance-matching network with 0402 SMT resistors is implemented according to the modeling results. And its performance is demonstrated.

Original languageAmerican English
Pages (from-to)984-987
Number of pages4
JournalProceedings of the IEEE International Symposium on Electromagnetic Compatibility, 2004
DOIs
StatePublished - Aug 1 2004
Event2004 International Symposium on Electromagnetic Compatibility, EMC 2004 - Santa Clara, CA, United States
Duration: Aug 9 2004Aug 13 2004

ASJC Scopus Subject Areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Keywords

  • CEMPIE
  • Impedance-matching network
  • Parasitics
  • PEEC

Disciplines

  • Electrical and Computer Engineering

Fingerprint

Dive into the research topics of 'The Design of a Lumped Element Impedance-Matching Network with Reduced Parasitic Effects Obtained From Numerical Modeling'. Together they form a unique fingerprint.

Cite this