Study on the effect of wafer back grinding process on nanomechanical behavior of multilayered low-k stack

Vasarla Nagendra Sekhar; Lu Shen; Aditya Kumar; Tai Chong Chai; Xiaowu Zhang; C. S. Premchandran; Vaidyanathan Kripesh; Seung Wook Yoon; John H. Lau

doi:10.1109/TCPMT.2011.2141989

Study on the effect of wafer back grinding process on nanomechanical behavior of multilayered low-k stack

Vasarla Nagendra Sekhar
, Lu Shen
, Aditya Kumar
, Tai Chong Chai
, Xiaowu Zhang
, C. S. Premchandran
, Vaidyanathan Kripesh
, Seung Wook Yoon
, John H. Lau

Agency for Science, Technology and Research, Singapore
Global Foundries
STATS ChipPAC Ltd.
Industrial Technology Research Institute of Taiwan

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	6093739
Pages (from-to)	3-12
Number of pages	10
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	2
Issue number	1
DOIs	https://doi.org/10.1109/TCPMT.2011.2141989
State	Published - Jan 2012
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Keywords

3-D packaging
low-k stack
nanoindentation
nanoscratch
transmission electron microscopy analysis
wafer back grinding/wafer thinning

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10.1109/TCPMT.2011.2141989

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Sekhar, V. N., Shen, L., Kumar, A., Chai, T. C., Zhang, X., Premchandran, C. S., Kripesh, V., Yoon, S. W., & Lau, J. H. (2012). Study on the effect of wafer back grinding process on nanomechanical behavior of multilayered low-k stack. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2(1), 3-12. Article 6093739. https://doi.org/10.1109/TCPMT.2011.2141989

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title = "Study on the effect of wafer back grinding process on nanomechanical behavior of multilayered low-k stack",

keywords = "3-D packaging, low-k stack, nanoindentation, nanoscratch, transmission electron microscopy analysis, wafer back grinding/wafer thinning",

author = "Sekhar, \{Vasarla Nagendra\} and Lu Shen and Aditya Kumar and Chai, \{Tai Chong\} and Xiaowu Zhang and Premchandran, \{C. S.\} and Vaidyanathan Kripesh and Yoon, \{Seung Wook\} and Lau, \{John H.\}",

year = "2012",

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doi = "10.1109/TCPMT.2011.2141989",

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AU - Sekhar, Vasarla Nagendra

AU - Shen, Lu

AU - Kumar, Aditya

AU - Chai, Tai Chong

AU - Zhang, Xiaowu

AU - Premchandran, C. S.

AU - Kripesh, Vaidyanathan

AU - Yoon, Seung Wook

AU - Lau, John H.

PY - 2012/1

Y1 - 2012/1

KW - 3-D packaging

KW - low-k stack

KW - nanoindentation

KW - nanoscratch

KW - transmission electron microscopy analysis

KW - wafer back grinding/wafer thinning

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U2 - 10.1109/TCPMT.2011.2141989

DO - 10.1109/TCPMT.2011.2141989

M3 - Article

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

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Study on the effect of wafer back grinding process on nanomechanical behavior of multilayered low-k stack

ASJC Scopus Subject Areas

Keywords

Access to Document

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