@inproceedings{8b82a3b17c1d4a43ae670154302f9517,
title = "Study of Thickening Soldermask Coated Microstrip Lines on High-Speed PCBs for Crosstalk Reduction in DDR5",
keywords = "DDR5, Far-end crosstalk, microstrip line, printed circuit board (PCB), thickening soldermask",
author = "Yu, \{Xiao Bo\} and Cai, \{Qiang Ming\} and Yinglei Ren and Xiaoning Ye and Jun Fan",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020 ; Conference date: 28-07-2020 Through 28-08-2020",
year = "2020",
month = jul,
doi = "10.1109/EMCSI38923.2020.9191539",
language = "English",
series = "2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "575--577",
booktitle = "2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020",
}