Study of 15μm pitch solder microbumps for 3D IC integration

Aibin Yu; John H. Lau; Soon Wee Ho; Aditya Kumar; Wai Yin Hnin; Da Quan Yu; Ming Ching Jong; Vaidyanathan Kripesh; Damaruganath Pinjala; Dim Lee Kwong

doi:10.1109/ECTC.2009.5073988

Study of 15μm pitch solder microbumps for 3D IC integration

Aibin Yu
, John H. Lau
, Soon Wee Ho
, Aditya Kumar
, Wai Yin Hnin
, Da Quan Yu
, Ming Ching Jong
, Vaidyanathan Kripesh
, Damaruganath Pinjala
, Dim Lee Kwong

Agency for Science, Technology and Research, Singapore
Hong Kong University of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
Pages	6-10
Number of pages	5
DOIs	https://doi.org/10.1109/ECTC.2009.5073988
State	Published - 2009
Externally published	Yes
Event	2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States Duration: May 26 2009 → May 29 2009

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2009 59th Electronic Components and Technology Conference, ECTC 2009
Country/Territory	United States
City	San Diego, CA
Period	5/26/09 → 5/29/09

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2009.5073988

Cite this

Yu, A., Lau, J. H., Ho, S. W., Kumar, A., Hnin, W. Y., Yu, D. Q., Jong, M. C., Kripesh, V., Pinjala, D., & Kwong, D. L. (2009). Study of 15μm pitch solder microbumps for 3D IC integration. In 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009 (pp. 6-10). Article 5073988 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2009.5073988

Yu, A, Lau, JH, Ho, SW, Kumar, A, Hnin, WY, Yu, DQ, Jong, MC, Kripesh, V, Pinjala, D & Kwong, DL 2009, Study of 15μm pitch solder microbumps for 3D IC integration. in 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009., 5073988, Proceedings - Electronic Components and Technology Conference, pp. 6-10, 2009 59th Electronic Components and Technology Conference, ECTC 2009, San Diego, CA, United States, 5/26/09. https://doi.org/10.1109/ECTC.2009.5073988

@inproceedings{a457a5d1bd264c12a861b09180c2861b,

title = "Study of 15μm pitch solder microbumps for 3D IC integration",

author = "Aibin Yu and Lau, \{John H.\} and Ho, \{Soon Wee\} and Aditya Kumar and Hnin, \{Wai Yin\} and Yu, \{Da Quan\} and Jong, \{Ming Ching\} and Vaidyanathan Kripesh and Damaruganath Pinjala and Kwong, \{Dim Lee\}",

year = "2009",

doi = "10.1109/ECTC.2009.5073988",

language = "English",

isbn = "9781424444762",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "6--10",

booktitle = "2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009",

note = "2009 59th Electronic Components and Technology Conference, ECTC 2009 ; Conference date: 26-05-2009 Through 29-05-2009",

}

TY - GEN

T1 - Study of 15μm pitch solder microbumps for 3D IC integration

AU - Yu, Aibin

AU - Lau, John H.

AU - Ho, Soon Wee

AU - Kumar, Aditya

AU - Hnin, Wai Yin

AU - Yu, Da Quan

AU - Jong, Ming Ching

AU - Kripesh, Vaidyanathan

AU - Pinjala, Damaruganath

AU - Kwong, Dim Lee

PY - 2009

Y1 - 2009

UR - https://www.scopus.com/pages/publications/70349686526

UR - https://www.scopus.com/pages/publications/70349686526#tab=citedBy

U2 - 10.1109/ECTC.2009.5073988

DO - 10.1109/ECTC.2009.5073988

M3 - Conference contribution

AN - SCOPUS:70349686526

SN - 9781424444762

T3 - Proceedings - Electronic Components and Technology Conference

SP - 6

EP - 10

BT - 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009

T2 - 2009 59th Electronic Components and Technology Conference, ECTC 2009

Y2 - 26 May 2009 through 29 May 2009

ER -

Study of 15μm pitch solder microbumps for 3D IC integration

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Conference

ASJC Scopus Subject Areas

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