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Stress and thermal characterization of 4H-SiC microelectromechanical structures

  • Colton Wells
  • , Jheng Yi Jiang
  • , Ting Fu Chang
  • , Chih Fang Huang
  • , Jiaxin Ke
  • , Weijun Luo
  • , Guangrui Xia
  • , Kuan Yew Cheong
  • , Feng Zhao
  • Washington State University Vancouver
  • National Tsing Hua University
  • University of British Columbia
  • Universiti Sains Malaysia

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)196-199
Number of pages4
JournalMaterials Letters
Volume191
DOIs
StatePublished - Mar 15 2017
Externally publishedYes

ASJC Scopus Subject Areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Keywords

  • Micro-Raman
  • Microelectromechanical structure
  • Resistance thermometer
  • Silicon carbide
  • Temperature sensing

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