@article{8a90176893b840caab03172edd6b5f81,
title = "Spontaneous, non-aqueous electrochemical deposition of Copper and palladium on Al and Al(Cu) thin films",
keywords = "Copper, Electrochemical deposition, Non-aqueous, Palladium, Selective, Solder",
author = "R. Fang and H. Gu and O'Keefe, \{M. J.\} and O'Keefe, \{T. J.\} and Shih, \{W. S.\} and Leedy, \{K. D.\} and R. Cortez",
year = "2001",
month = apr,
doi = "10.1007/s11664-001-0042-y",
language = "English",
volume = "30",
pages = "349--354",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
number = "4",
}