Solving Electromagnetic Scattering Contribution from Each Component Region with HO-SIE-DDM Solver

Quan Deng; Qiang Ming Cai; Xin Cao; Wen Jiang; Yuying Zhu; Yuyu Zhu; Jun Fan

doi:10.1109/APEMC53576.2022.9888444

Solving Electromagnetic Scattering Contribution from Each Component Region with HO-SIE-DDM Solver

Quan Deng
, Qiang Ming Cai
, Xin Cao
, Wen Jiang
, Yuying Zhu
, Yuyu Zhu
, Jun Fan

Southwest University of Science and Technology
Ltd.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	533-535
Number of pages	3
ISBN (Electronic)	9781665416719
DOIs	https://doi.org/10.1109/APEMC53576.2022.9888444
State	Published - 2022
Externally published	Yes
Event	13th Asia-Pacific International Symposium on Electromagnetic Compatibility and Technical Exhibition, APEMC 2022 - Beijing, China Duration: Sep 1 2022 → Sep 4 2022

Publication series

Name	2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022

Conference

Conference	13th Asia-Pacific International Symposium on Electromagnetic Compatibility and Technical Exhibition, APEMC 2022
Country/Territory	China
City	Beijing
Period	9/1/22 → 9/4/22

ASJC Scopus Subject Areas

Hardware and Architecture
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Radiation

Keywords

component electromagnetic flow
discontinuous Galerkin
Domain decomposition method (DDM)
higher order hierarchical vector (HOHV) basis functions
scattering contribution
surface integral equation (SIE)

Access to Document

10.1109/APEMC53576.2022.9888444

Cite this

Deng, Q., Cai, Q. M., Cao, X., Jiang, W., Zhu, Y., Zhu, Y., & Fan, J. (2022). Solving Electromagnetic Scattering Contribution from Each Component Region with HO-SIE-DDM Solver. In 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022 (pp. 533-535). (2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEMC53576.2022.9888444

Solving Electromagnetic Scattering Contribution from Each Component Region with HO-SIE-DDM Solver. / Deng, Quan; Cai, Qiang Ming; Cao, Xin et al.
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 533-535 (2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Deng, Q, Cai, QM, Cao, X, Jiang, W, Zhu, Y, Zhu, Y & Fan, J 2022, Solving Electromagnetic Scattering Contribution from Each Component Region with HO-SIE-DDM Solver. in 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022. 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022, Institute of Electrical and Electronics Engineers Inc., pp. 533-535, 13th Asia-Pacific International Symposium on Electromagnetic Compatibility and Technical Exhibition, APEMC 2022, Beijing, China, 9/1/22. https://doi.org/10.1109/APEMC53576.2022.9888444

Deng Q, Cai QM, Cao X, Jiang W, Zhu Y, Zhu Y et al. Solving Electromagnetic Scattering Contribution from Each Component Region with HO-SIE-DDM Solver. In 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022. Institute of Electrical and Electronics Engineers Inc. 2022. p. 533-535. (2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022). doi: 10.1109/APEMC53576.2022.9888444

Deng, Quan ; Cai, Qiang Ming ; Cao, Xin et al. / Solving Electromagnetic Scattering Contribution from Each Component Region with HO-SIE-DDM Solver. 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 533-535 (2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022).

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title = "Solving Electromagnetic Scattering Contribution from Each Component Region with HO-SIE-DDM Solver",

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author = "Quan Deng and Cai, \{Qiang Ming\} and Xin Cao and Wen Jiang and Yuying Zhu and Yuyu Zhu and Jun Fan",

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KW - higher order hierarchical vector (HOHV) basis functions

KW - scattering contribution

KW - surface integral equation (SIE)

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Solving Electromagnetic Scattering Contribution from Each Component Region with HO-SIE-DDM Solver

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ASJC Scopus Subject Areas

Keywords

Access to Document

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