Abstract
The interfacial bond between the fiber and matrix in a polymer composite is considered to be one of the key factors affecting the macroscopic properties of the composite. Consequently, there is a need to characterize bond strength. A test technique called `bundle debond' has been developed at the Graduate Center for Materials Research at the University of Missouri-Rolla. The method uses a unique yet simple specimen geometry for measuring the bond strength between a fiber bundle and a polymer matrix. Although developed with polymer matrix composites, this technique is believed to be adaptable for ceramic matrix composites as well.
| Original language | American English |
|---|---|
| Pages (from-to) | 8-10 |
| Number of pages | 3 |
| Journal | Materials Technology |
| Volume | 10 |
| Issue number | 1-2 |
| DOIs | |
| State | Published - Jan 1 1995 |
ASJC Scopus Subject Areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Disciplines
- Chemistry
Fingerprint
Dive into the research topics of 'Simpler Test Method for Measuring the Interfacial Strength of Fiber Tows in Polymer and Ceramic Matrix Composites'. Together they form a unique fingerprint.Cite this
- APA
- Standard
- Harvard
- Vancouver
- Author
- BIBTEX
- RIS