Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism

Z. Xu; Jun Fan; O. Maurice

doi:10.1109/EMCCompo.2019.8919915

Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism

Z. Xu
, Jun Fan
, O. Maurice

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron's mesh impedance tensor obtained via the PCB Kron's equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS® parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.

Original language	American English
Journal	Proceedings of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (2019, Haining, Hangzhou, China)
DOIs	https://doi.org/10.1109/EMCCompo.2019.8919915
State	Published - Oct 1 2019

Keywords

Modelling
Printed Circuit Board (PCB)
S Parameter Analysis
Sensitivity Analysis (SA)
Tensorial Analysis of Network (TAN)

Disciplines

Electrical and Computer Engineering

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10.1109/EMCCompo.2019.8919915License: Unspecified

https://doi.org/10.1109/EMCCompo.2019.8919915

Cite this

@article{d0f8bee153514296a79b2f6d2bf8d191,

title = "Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism",

abstract = " This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron's mesh impedance tensor obtained via the PCB Kron's equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS{\textregistered} parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.",

keywords = "Modelling, Printed Circuit Board (PCB), S Parameter Analysis, Sensitivity Analysis (SA), Tensorial Analysis of Network (TAN)",

author = "Z. Xu and Jun Fan and O. Maurice",

year = "2019",

month = oct,

day = "1",

doi = "10.1109/EMCCompo.2019.8919915",

language = "American English",

journal = "Proceedings of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (2019, Haining, Hangzhou, China)",

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TY - JOUR

T1 - Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism

AU - Xu, Z.

AU - Fan, Jun

AU - Maurice, O.

PY - 2019/10/1

Y1 - 2019/10/1

N2 - This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron's mesh impedance tensor obtained via the PCB Kron's equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS® parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.

AB - This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron's mesh impedance tensor obtained via the PCB Kron's equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS® parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.

KW - Modelling

KW - Printed Circuit Board (PCB)

KW - S Parameter Analysis

KW - Sensitivity Analysis (SA)

KW - Tensorial Analysis of Network (TAN)

UR - https://scholarsmine.mst.edu/ele_comeng_facwork/4143

UR - https://doi.org/10.1109/EMCCompo.2019.8919915

U2 - 10.1109/EMCCompo.2019.8919915

DO - 10.1109/EMCCompo.2019.8919915

M3 - Article

JO - Proceedings of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (2019, Haining, Hangzhou, China)

JF - Proceedings of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (2019, Haining, Hangzhou, China)

ER -

Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism

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Keywords

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