Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions

Xin Chang; Bruce Archambeault; Matteo Cocchini; Francesco de Paulis; Vysakh Sivarajan; Yaojiang Zhang; Jun Fan; Samuel R. Connor; Antonio Orlandi; James L. Drewniak

doi:10.1109/EMCEUROPE.2008.4786874

Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions

Xin Chang
, Bruce Archambeault
, Matteo Cocchini
, Francesco de Paulis
, Vysakh Sivarajan
, Yaojiang Zhang
, Jun Fan
, Samuel R. Connor
, Antonio Orlandi
, James L. Drewniak

Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.

Original language	American English
Article number	4786874
Journal	Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008, Hamburg, Germany)
DOIs	https://doi.org/10.1109/EMCEUROPE.2008.4786874
State	Published - Sep 1 2008
Event	2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 - Detroit, MI, Germany Duration: Aug 18 2008 → Aug 22 2008

Keywords

Cavity Effects
Cavity Resonance
EMI
Reference Planes
Return Currents
Signal Integrity
Via
Cavity Resonators
Electric Inverters
Electromagnetic Pulse
Plastic Molds
Resonance
Signal Processing
Electromagnetic Compatibility
Bandwidth
Electromagnetic Interference
Impedance
Dielectric Losses
Equivalent Circuits
Signal Analysis
Analytical Models
Circuit Simulation
Capacitors
Integrated Circuit Interconnections
Return Via Connections
Signal Link Path Bandwidth
Via Transitions
Return Current
Equivalent Circuit

Disciplines

Electrical and Computer Engineering

Access to Document

10.1109/EMCEUROPE.2008.4786874License: CC BY

https://doi.org/10.1109/EMCEUROPE.2008.4786874

Cite this

Chang, X., Archambeault, B., Cocchini, M., de Paulis, F., Sivarajan, V., Zhang, Y., Fan, J., Connor, S. R., Orlandi, A., & Drewniak, J. L. (2008). Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions. Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008, Hamburg, Germany), Article 4786874. https://doi.org/10.1109/EMCEUROPE.2008.4786874

Chang, X, Archambeault, B, Cocchini, M, de Paulis, F, Sivarajan, V, Zhang, Y, Fan, J, Connor, SR, Orlandi, A & Drewniak, JL 2008, 'Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions', Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008, Hamburg, Germany). https://doi.org/10.1109/EMCEUROPE.2008.4786874

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title = "Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions",

abstract = " This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.",

keywords = "Cavity Effects, Cavity Resonance, EMI, Reference Planes, Return Currents, Signal Integrity, Via, Cavity Resonators, Electric Inverters, Electromagnetic Pulse, Plastic Molds, Resonance, Signal Processing, Electromagnetic Compatibility, Bandwidth, Electromagnetic Interference, Impedance, Dielectric Losses, Equivalent Circuits, Signal Analysis, Analytical Models, Circuit Simulation, Capacitors, Integrated Circuit Interconnections, Return Via Connections, Signal Link Path Bandwidth, Via Transitions, Return Current, Equivalent Circuit",

author = "Xin Chang and Bruce Archambeault and Matteo Cocchini and \{de Paulis\}, Francesco and Vysakh Sivarajan and Yaojiang Zhang and Jun Fan and Connor, \{Samuel R.\} and Antonio Orlandi and Drewniak, \{James L.\}",

year = "2008",

month = sep,

day = "1",

doi = "10.1109/EMCEUROPE.2008.4786874",

language = "American English",

journal = "Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008, Hamburg, Germany)",

note = "2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 ; Conference date: 18-08-2008 Through 22-08-2008",

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TY - JOUR

T1 - Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions

AU - Chang, Xin

AU - Archambeault, Bruce

AU - Cocchini, Matteo

AU - de Paulis, Francesco

AU - Sivarajan, Vysakh

AU - Zhang, Yaojiang

AU - Fan, Jun

AU - Connor, Samuel R.

AU - Orlandi, Antonio

AU - Drewniak, James L.

PY - 2008/9/1

Y1 - 2008/9/1

N2 - This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.

AB - This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.

KW - Cavity Effects

KW - Cavity Resonance

KW - EMI

KW - Reference Planes

KW - Return Currents

KW - Signal Integrity

KW - Via

KW - Cavity Resonators

KW - Electric Inverters

KW - Electromagnetic Pulse

KW - Plastic Molds

KW - Resonance

KW - Signal Processing

KW - Electromagnetic Compatibility

KW - Bandwidth

KW - Electromagnetic Interference

KW - Impedance

KW - Dielectric Losses

KW - Equivalent Circuits

KW - Signal Analysis

KW - Analytical Models

KW - Circuit Simulation

KW - Capacitors

KW - Integrated Circuit Interconnections

KW - Return Via Connections

KW - Signal Link Path Bandwidth

KW - Via Transitions

KW - Return Current

KW - Equivalent Circuit

UR - https://scholarsmine.mst.edu/ele_comeng_facwork/2797

UR - https://doi.org/10.1109/EMCEUROPE.2008.4786874

U2 - 10.1109/EMCEUROPE.2008.4786874

DO - 10.1109/EMCEUROPE.2008.4786874

M3 - Article

JO - Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008, Hamburg, Germany)

JF - Proceedings of the IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008, Hamburg, Germany)

M1 - 4786874

T2 - 2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008

Y2 - 18 August 2008 through 22 August 2008

ER -

Return Via Connections for Extending Signal Link Path Bandwidth of Via Transitions

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