Residual stress analysis in thin device wafer using piezoresistive stress sensor

Aditya Kumar; Xiaowu Zhang; Qing Xin Zhang; Ming Chinq Jong; Guanbo Huang; Lee Wen Sheng Vincent; Vaidyanathan Kripesh; Charles Lee; John H. Lau; Dim Lee Kwong; Venky Sundaram; Rao R. Tummula; Georg Meyer-Berg

doi:10.1109/TCPMT.2011.2135353

Residual stress analysis in thin device wafer using piezoresistive stress sensor

Aditya Kumar
, Xiaowu Zhang
, Qing Xin Zhang
, Ming Chinq Jong
, Guanbo Huang
, Lee Wen Sheng Vincent
, Vaidyanathan Kripesh
, Charles Lee
, John H. Lau
, Dim Lee Kwong
, Venky Sundaram
, Rao R. Tummula
, Georg Meyer-Berg

Agency for Science, Technology and Research, Singapore
Nanyang Technological University
Georgia Institute of Technology
Infineon Technologies AG

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	5778967
Pages (from-to)	841-851
Number of pages	11
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	1
Issue number	6
DOIs	https://doi.org/10.1109/TCPMT.2011.2135353
State	Published - Jun 2011
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Keywords

Piezoresistive sensor
residual stress
tape mounting
wafer back-grinding
wafer bow

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10.1109/TCPMT.2011.2135353

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Kumar, A., Zhang, X., Zhang, Q. X., Jong, M. C., Huang, G., Vincent, L. W. S., Kripesh, V., Lee, C., Lau, J. H., Kwong, D. L., Sundaram, V., Tummula, R. R., & Meyer-Berg, G. (2011). Residual stress analysis in thin device wafer using piezoresistive stress sensor. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1(6), 841-851. Article 5778967. https://doi.org/10.1109/TCPMT.2011.2135353

Kumar, A, Zhang, X, Zhang, QX, Jong, MC, Huang, G, Vincent, LWS, Kripesh, V, Lee, C, Lau, JH, Kwong, DL, Sundaram, V, Tummula, RR & Meyer-Berg, G 2011, 'Residual stress analysis in thin device wafer using piezoresistive stress sensor', IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 6, 5778967, pp. 841-851. https://doi.org/10.1109/TCPMT.2011.2135353

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title = "Residual stress analysis in thin device wafer using piezoresistive stress sensor",

keywords = "Piezoresistive sensor, residual stress, tape mounting, wafer back-grinding, wafer bow",

author = "Aditya Kumar and Xiaowu Zhang and Zhang, \{Qing Xin\} and Jong, \{Ming Chinq\} and Guanbo Huang and Vincent, \{Lee Wen Sheng\} and Vaidyanathan Kripesh and Charles Lee and Lau, \{John H.\} and Kwong, \{Dim Lee\} and Venky Sundaram and Tummula, \{Rao R.\} and Georg Meyer-Berg",

year = "2011",

month = jun,

doi = "10.1109/TCPMT.2011.2135353",

language = "English",

volume = "1",

pages = "841--851",

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AU - Kumar, Aditya

AU - Zhang, Xiaowu

AU - Zhang, Qing Xin

AU - Jong, Ming Chinq

AU - Huang, Guanbo

AU - Vincent, Lee Wen Sheng

AU - Kripesh, Vaidyanathan

AU - Lee, Charles

AU - Lau, John H.

AU - Kwong, Dim Lee

AU - Sundaram, Venky

AU - Tummula, Rao R.

AU - Meyer-Berg, Georg

PY - 2011/6

Y1 - 2011/6

KW - Piezoresistive sensor

KW - residual stress

KW - tape mounting

KW - wafer back-grinding

KW - wafer bow

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UR - https://www.scopus.com/pages/publications/80053352930#tab=citedBy

U2 - 10.1109/TCPMT.2011.2135353

DO - 10.1109/TCPMT.2011.2135353

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AN - SCOPUS:80053352930

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 6

M1 - 5778967

ER -

Residual stress analysis in thin device wafer using piezoresistive stress sensor

ASJC Scopus Subject Areas

Keywords

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