Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz

Renato Rimolo-Donadio; Xiaoxiong Gu; Young H. Kwark; Mark B. Ritter; Bruce Archambeault; Francesco De Paulis; Yaojiang Zhang; Jun Fan; Heinz Dietrich Brüns; Christian Schuster

doi:10.1109/TMTT.2009.2025470

Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz

Renato Rimolo-Donadio
, Xiaoxiong Gu
, Young H. Kwark
, Mark B. Ritter
, Bruce Archambeault
, Francesco De Paulis
, Yaojiang Zhang
, Jun Fan
, Heinz Dietrich Brüns
, Christian Schuster

Electrical and Computer Engineering

Hamburg University of Technology
IBM
University of L'Aquila
Agency for Science, Technology and Research, Singapore

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	5173506
Pages (from-to)	2072-2083
Number of pages	12
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	57
Issue number	8
DOIs	https://doi.org/10.1109/TMTT.2009.2025470
State	Published - 2009

ASJC Scopus Subject Areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

Keywords

Modal decomposition
Package
Power distribution network (PDN)
Printed circuit board (PCB)
Via models

Access to Document

10.1109/TMTT.2009.2025470

Cite this

Rimolo-Donadio, R., Gu, X., Kwark, Y. H., Ritter, M. B., Archambeault, B., De Paulis, F., Zhang, Y., Fan, J., Brüns, H. D., & Schuster, C. (2009). Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz. IEEE Transactions on Microwave Theory and Techniques, 57(8), 2072-2083. Article 5173506. https://doi.org/10.1109/TMTT.2009.2025470

Rimolo-Donadio, R, Gu, X, Kwark, YH, Ritter, MB, Archambeault, B, De Paulis, F, Zhang, Y, Fan, J, Brüns, HD & Schuster, C 2009, 'Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz', IEEE Transactions on Microwave Theory and Techniques, vol. 57, no. 8, 5173506, pp. 2072-2083. https://doi.org/10.1109/TMTT.2009.2025470

@article{bf9502ce1f1642cfb67402dbe2c72b0c,

title = "Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz",

keywords = "Modal decomposition, Package, Power distribution network (PDN), Printed circuit board (PCB), Via models",

author = "Renato Rimolo-Donadio and Xiaoxiong Gu and Kwark, \{Young H.\} and Ritter, \{Mark B.\} and Bruce Archambeault and \{De Paulis\}, Francesco and Yaojiang Zhang and Jun Fan and Br{\"u}ns, \{Heinz Dietrich\} and Christian Schuster",

year = "2009",

doi = "10.1109/TMTT.2009.2025470",

language = "English",

volume = "57",

pages = "2072--2083",

journal = "IEEE Transactions on Microwave Theory and Techniques",

issn = "0018-9480",

number = "8",

}

TY - JOUR

T1 - Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz

AU - Rimolo-Donadio, Renato

AU - Gu, Xiaoxiong

AU - Kwark, Young H.

AU - Ritter, Mark B.

AU - Archambeault, Bruce

AU - De Paulis, Francesco

AU - Zhang, Yaojiang

AU - Fan, Jun

AU - Brüns, Heinz Dietrich

AU - Schuster, Christian

PY - 2009

Y1 - 2009

KW - Modal decomposition

KW - Package

KW - Power distribution network (PDN)

KW - Printed circuit board (PCB)

KW - Via models

UR - https://www.scopus.com/pages/publications/77958096098

UR - https://www.scopus.com/pages/publications/77958096098#tab=citedBy

U2 - 10.1109/TMTT.2009.2025470

DO - 10.1109/TMTT.2009.2025470

M3 - Article

AN - SCOPUS:77958096098

SN - 0018-9480

VL - 57

SP - 2072

EP - 2083

JO - IEEE Transactions on Microwave Theory and Techniques

JF - IEEE Transactions on Microwave Theory and Techniques

IS - 8

M1 - 5173506

ER -

Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz

ASJC Scopus Subject Areas

Keywords

Access to Document

Other files and links

Fingerprint

Cite this