PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions

Zhixin Xia; Yunlong Luo; Yihong Qi; Jun Fan; Xiaoning Ye

doi:10.1109/APEMC53576.2022.9888294

PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions

Zhixin Xia
, Yunlong Luo
, Yihong Qi
, Jun Fan
, Xiaoning Ye

LinkE Technologies (Hengqin)
Southwest University of Science and Technology
Intel

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	627-629
Number of pages	3
ISBN (Electronic)	9781665416719
DOIs	https://doi.org/10.1109/APEMC53576.2022.9888294
State	Published - 2022
Externally published	Yes
Event	13th Asia-Pacific International Symposium on Electromagnetic Compatibility and Technical Exhibition, APEMC 2022 - Beijing, China Duration: Sep 1 2022 → Sep 4 2022

Publication series

Name	2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022

Conference

Conference	13th Asia-Pacific International Symposium on Electromagnetic Compatibility and Technical Exhibition, APEMC 2022
Country/Territory	China
City	Beijing
Period	9/1/22 → 9/4/22

ASJC Scopus Subject Areas

Hardware and Architecture
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Radiation

Keywords

dielectric properties
PCB
signal integrity
signal integrity/power integrity (SI/PI) co-analysis

Access to Document

10.1109/APEMC53576.2022.9888294

Cite this

Xia, Z., Luo, Y., Qi, Y., Fan, J., & Ye, X. (2022). PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions. In 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022 (pp. 627-629). (2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEMC53576.2022.9888294

PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions. / Xia, Zhixin; Luo, Yunlong; Qi, Yihong et al.
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 627-629 (2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Xia, Z, Luo, Y, Qi, Y, Fan, J & Ye, X 2022, PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions. in 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022. 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022, Institute of Electrical and Electronics Engineers Inc., pp. 627-629, 13th Asia-Pacific International Symposium on Electromagnetic Compatibility and Technical Exhibition, APEMC 2022, Beijing, China, 9/1/22. https://doi.org/10.1109/APEMC53576.2022.9888294

Xia Z, Luo Y, Qi Y, Fan J, Ye X. PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions. In 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022. Institute of Electrical and Electronics Engineers Inc. 2022. p. 627-629. (2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022). doi: 10.1109/APEMC53576.2022.9888294

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title = "PCB-Level Thermal \& SI/PI Co-Analysis: Progress and Directions",

keywords = "dielectric properties, PCB, signal integrity, signal integrity/power integrity (SI/PI) co-analysis",

author = "Zhixin Xia and Yunlong Luo and Yihong Qi and Jun Fan and Xiaoning Ye",

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M3 - Conference contribution

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PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions

Publication series

Conference

ASJC Scopus Subject Areas

Keywords

Access to Document

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