Abstract
Numerical method is used to investigate the glass weave effects on via coupling and trace transmission properties. Studies indicate that a simple two-dimensional periodic structure is accurate enough for via coupling simulations while more complicated three-dimensional glass-weave structures have to be used for studies of trace transmission properties. Analytical formulas are provided to estimate the first resonant frequency of the glass weaves. The impact of trace-glass-weave orientations on resonances of traces has been investigated for both single-ended and differential striplines. It has been demonstrated that statistical Gaussian distribution of pitch sizes due to fabrication tolerance and the dielectric losses can reduce the glass-weave effects. The studies here are useful for better understanding of the high-frequency signal integrity performance of printed circuit boards.
| Original language | American English |
|---|---|
| Journal | Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2014, Raleigh, NC) |
| DOIs | |
| State | Published - Aug 8 2014 |
Keywords
- Analytical formulas
- Coupling simulation
- Dielectric losses
- Electromagnetic compatibility
- Fabrication tolerances
- Glass
- Glass-weave
- High frequency signals
- High-speed interconnects
- Natural frequencies
- Numerical investigations
- Numerical methods
- Printed circuit boards
- Printed circuits
- Resonance
- Scattering parameters
- Strip telecommunication lines
- Transmission property
- Two-dimensional periodic structures
- Weaving
Disciplines
- Electrical and Computer Engineering
- Numerical Analysis and Scientific Computing
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