Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach

L. J. Jiang; B. J. Rubin; J. D. Morsey; H. T. Hu; A. Elfadel

doi:10.1109/EPEP.2006.321245

Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach

L. J. Jiang
, B. J. Rubin
, J. D. Morsey
, H. T. Hu
, A. Elfadel

IBM

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Electrical Performance of Electronic Packaging, EPEP
Pages	331-334
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2006.321245
State	Published - 2006
Externally published	Yes
Event	14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP - Scottsdale, AZ, United States Duration: Oct 23 2006 → Oct 25 2006

Publication series

Name	Electrical Performance of Electronic Packaging, EPEP

Conference

Conference	14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Country/Territory	United States
City	Scottsdale, AZ
Period	10/23/06 → 10/25/06

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/EPEP.2006.321245

Cite this

Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach. / Jiang, L. J.; Rubin, B. J.; Morsey, J. D. et al.
Electrical Performance of Electronic Packaging, EPEP. 2006. p. 331-334 4115423 (Electrical Performance of Electronic Packaging, EPEP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Jiang, LJ, Rubin, BJ, Morsey, JD, Hu, HT & Elfadel, A 2006, Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach. in Electrical Performance of Electronic Packaging, EPEP., 4115423, Electrical Performance of Electronic Packaging, EPEP, pp. 331-334, 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, Scottsdale, AZ, United States, 10/23/06. https://doi.org/10.1109/EPEP.2006.321245

@inproceedings{f377b8767fba4435a4c794e8eac63bb3,

title = "Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach",

author = "Jiang, \{L. J.\} and Rubin, \{B. J.\} and Morsey, \{J. D.\} and Hu, \{H. T.\} and A. Elfadel",

year = "2006",

doi = "10.1109/EPEP.2006.321245",

language = "English",

isbn = "1424406684",

series = "Electrical Performance of Electronic Packaging, EPEP",

pages = "331--334",

booktitle = "Electrical Performance of Electronic Packaging, EPEP",

note = "14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP ; Conference date: 23-10-2006 Through 25-10-2006",

}

TY - GEN

T1 - Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach

AU - Jiang, L. J.

AU - Rubin, B. J.

AU - Morsey, J. D.

AU - Hu, H. T.

AU - Elfadel, A.

PY - 2006

Y1 - 2006

UR - https://www.scopus.com/pages/publications/50049113684

UR - https://www.scopus.com/pages/publications/50049113684#tab=citedBy

U2 - 10.1109/EPEP.2006.321245

DO - 10.1109/EPEP.2006.321245

M3 - Conference contribution

AN - SCOPUS:50049113684

SN - 1424406684

SN - 9781424406685

T3 - Electrical Performance of Electronic Packaging, EPEP

SP - 331

EP - 334

BT - Electrical Performance of Electronic Packaging, EPEP

T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP

Y2 - 23 October 2006 through 25 October 2006

ER -

Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

Other files and links

Fingerprint

Cite this