Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB

Matteo Cocchini; Jun Fan; Bruce Archambeault; James L. Knighten; Xin Chang; James L. Drewniak; Yaojiang Zhang; Samuel R. Connor

doi:10.1109/ISEMC.2008.4652163

Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB

Matteo Cocchini
, Jun Fan
, Bruce Archambeault
, James L. Knighten
, Xin Chang
, James L. Drewniak
, Yaojiang Zhang
, Samuel R. Connor

Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This paper studies the noise coupling mechanism caused by a differential pair of vias penetrating power/ground plane pair using a physics-based via-plane model combined with transmission line models for traces. A 26-layer printed circuit board with a pair of differential vias have been modeled. The simulated results clearly demonstrate the impact of ground vias and via stubs on noise coupling.

Original language	American English
Article number	4652163
Journal	Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2008, Detroit, MI)
Volume	2008-January
DOIs	https://doi.org/10.1109/ISEMC.2008.4652163
State	Published - Aug 1 2008
Event	2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 - Detroit, MI, Germany Duration: Aug 18 2008 → Aug 22 2008

Keywords

Cavity Model
Differential Signal
Ground Vias
Noise Coupling Between Signal and Power/Ground Nets
Signal Via Transition
Via Capacitance
Analysis
Noise
Integrated Circuit Modeling
Couplings
Geometry
Microstrip
Impedance
Stripline
Transmission Lines
Electromagnetic Coupling
Network Routing
Printed Circuits
Printed Circuit Board
Noise Coupling
Ground Nets
Power Nets
Differential Vias Transition
Multilayer PCB
Routing Trace
Transmission Line Model
Physics-Based Via-Plane Model

Disciplines

Electrical and Computer Engineering

Access to Document

10.1109/ISEMC.2008.4652163License: CC BY

Noise Coupling Between Power Ground Nets Due to Differential ViasFinal published version, 578 KBLicense: CC BY

Cite this

Cocchini, M., Fan, J., Archambeault, B., Knighten, J. L., Chang, X., Drewniak, J. L., Zhang, Y., & Connor, S. R. (2008). Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB. Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2008, Detroit, MI), 2008-January, Article 4652163. https://doi.org/10.1109/ISEMC.2008.4652163

Cocchini, M, Fan, J, Archambeault, B, Knighten, JL, Chang, X, Drewniak, JL, Zhang, Y & Connor, SR 2008, 'Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB', Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2008, Detroit, MI), vol. 2008-January, 4652163. https://doi.org/10.1109/ISEMC.2008.4652163

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title = "Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB",

abstract = " Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This paper studies the noise coupling mechanism caused by a differential pair of vias penetrating power/ground plane pair using a physics-based via-plane model combined with transmission line models for traces. A 26-layer printed circuit board with a pair of differential vias have been modeled. The simulated results clearly demonstrate the impact of ground vias and via stubs on noise coupling.",

keywords = "Cavity Model, Differential Signal, Ground Vias, Noise Coupling Between Signal and Power/Ground Nets, Signal Via Transition, Via Capacitance, Analysis, Noise, Integrated Circuit Modeling, Couplings, Geometry, Microstrip, Impedance, Stripline, Transmission Lines, Electromagnetic Coupling, Network Routing, Printed Circuits, Printed Circuit Board, Noise Coupling, Ground Nets, Power Nets, Differential Vias Transition, Multilayer PCB, Routing Trace, Transmission Line Model, Physics-Based Via-Plane Model",

author = "Matteo Cocchini and Jun Fan and Bruce Archambeault and Knighten, \{James L.\} and Xin Chang and Drewniak, \{James L.\} and Yaojiang Zhang and Connor, \{Samuel R.\}",

note = "Publisher Copyright: {\textcopyright} 2008 IEEE.; 2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 ; Conference date: 18-08-2008 Through 22-08-2008",

year = "2008",

month = aug,

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doi = "10.1109/ISEMC.2008.4652163",

language = "American English",

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AU - Cocchini, Matteo

AU - Fan, Jun

AU - Archambeault, Bruce

AU - Knighten, James L.

AU - Chang, Xin

AU - Drewniak, James L.

AU - Zhang, Yaojiang

AU - Connor, Samuel R.

PY - 2008/8/1

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N2 - Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This paper studies the noise coupling mechanism caused by a differential pair of vias penetrating power/ground plane pair using a physics-based via-plane model combined with transmission line models for traces. A 26-layer printed circuit board with a pair of differential vias have been modeled. The simulated results clearly demonstrate the impact of ground vias and via stubs on noise coupling.

AB - Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This paper studies the noise coupling mechanism caused by a differential pair of vias penetrating power/ground plane pair using a physics-based via-plane model combined with transmission line models for traces. A 26-layer printed circuit board with a pair of differential vias have been modeled. The simulated results clearly demonstrate the impact of ground vias and via stubs on noise coupling.

KW - Cavity Model

KW - Differential Signal

KW - Ground Vias

KW - Noise Coupling Between Signal and Power/Ground Nets

KW - Signal Via Transition

KW - Via Capacitance

KW - Analysis

KW - Noise

KW - Integrated Circuit Modeling

KW - Couplings

KW - Geometry

KW - Microstrip

KW - Impedance

KW - Stripline

KW - Transmission Lines

KW - Electromagnetic Coupling

KW - Network Routing

KW - Printed Circuits

KW - Printed Circuit Board

KW - Noise Coupling

KW - Ground Nets

KW - Power Nets

KW - Differential Vias Transition

KW - Multilayer PCB

KW - Routing Trace

KW - Transmission Line Model

KW - Physics-Based Via-Plane Model

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DO - 10.1109/ISEMC.2008.4652163

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VL - 2008-January

JO - Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2008, Detroit, MI)

JF - Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2008, Detroit, MI)

M1 - 4652163

T2 - 2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008

Y2 - 18 August 2008 through 22 August 2008

ER -

Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB

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Keywords

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