Abstract
An irregular plate pair with multiple vias sharing an anti-pad is decomposed into top/bottom plate-thickness domain and parallel-plate domain whose admittance matrices are calculated by three-dimensional (3D) finite element method (FEM) and hybrid 3D/2D FEM. Combined admittance matrix algorithm is used to obtain the final admittance matrix of the plate pair including finite thickness plates. The widely-used assumption of transverse electromagnetic (TEM) modes on anti-pads is carefully investigated by comparing the combined admittance matrix algorithm with hybrid 3D/2D FEM. It is found that higher-order modes are excited on anti-pads and in practical printed circuit board, the higher-order modes can penetrate from one layer of plate pair to another layer. This may provide guidance for future research for multiple vias in a shared anti-pad.
| Original language | American English |
|---|---|
| Journal | Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2014, Raleigh, NC) |
| DOIs | |
| State | Published - Aug 8 2014 |
Keywords
- Admittance matrices
- Domain decomposition methods
- Domain decompositions
- Electromagnetic compatibility
- Finite element method
- Finite thickness plates
- Higher-order modes
- Parallel plates
- Printed circuit boards
- Printed circuits
- Provide guidances
- Three dimensional (3 D) finite element methods (FEM)
- Transverse electromagnetic mode
Disciplines
- Electrical and Computer Engineering
- Numerical Analysis and Scientific Computing
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