Abstract
The multilayer ceramic capacitors (MLCCs) mounting method impact on the MLCC induced acoustic noise in printed circuit board (PCB) is investigated through measurement. The influence of MLCC soldering stencil height, MLCC orientation and MLCC pair offset distance are evaluated on a series of test boards. The sound pressure level (SPL) is measured to evaluate the PCB acoustic noise performance. In the investigated mounting variation range, the acoustic noise performance does not exhibit noticeable changes.
| Original language | American English |
|---|---|
| Journal | Proceedings of the 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity |
| DOIs | |
| State | Published - Sep 10 2020 |
Keywords
- Acoustic Noise
- Mirrored Layout
- Mounting
- Multilayer Ceramic Capacitors
- Power Distribution Network
- Sound Pressure Level
Disciplines
- Electrical and Computer Engineering
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