Material characterization and failure analysis of through-silicon vias

Chenglin Wu; Tengfei Jiang; Jay Im; Kenneth M. Liechti; Rui Huang; Paul S. Ho

doi:10.1109/IPFA.2014.6898206

Material characterization and failure analysis of through-silicon vias

Chenglin Wu
, Tengfei Jiang
, Jay Im
, Kenneth M. Liechti
, Rui Huang
, Paul S. Ho

Unknown
University of Texas at Austin
Texas Materials Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	312-316
Number of pages	5
ISBN (Electronic)	9781479939091
DOIs	https://doi.org/10.1109/IPFA.2014.6898206
State	Published - Sep 12 2014
Externally published	Yes
Event	21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014 - Singapore, Singapore Duration: Jun 30 2014 → Jul 4 2014

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Conference

Conference	21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014
Country/Territory	Singapore
City	Singapore
Period	6/30/14 → 7/4/14

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/IPFA.2014.6898206

Cite this

Wu, C., Jiang, T., Im, J., Liechti, K. M., Huang, R., & Ho, P. S. (2014). Material characterization and failure analysis of through-silicon vias. In Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014 (pp. 312-316). Article 6898206 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA.2014.6898206

Material characterization and failure analysis of through-silicon vias. / Wu, Chenglin; Jiang, Tengfei; Im, Jay et al.
Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 312-316 6898206 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wu, C, Jiang, T, Im, J, Liechti, KM, Huang, R & Ho, PS 2014, Material characterization and failure analysis of through-silicon vias. in Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014., 6898206, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Institute of Electrical and Electronics Engineers Inc., pp. 312-316, 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014, Singapore, Singapore, 6/30/14. https://doi.org/10.1109/IPFA.2014.6898206

Wu C, Jiang T, Im J, Liechti KM, Huang R, Ho PS. Material characterization and failure analysis of through-silicon vias. In Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 312-316. 6898206. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA.2014.6898206

Wu, Chenglin ; Jiang, Tengfei ; Im, Jay et al. / Material characterization and failure analysis of through-silicon vias. Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 312-316 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

@inproceedings{fc5ce622ffb744f090983cd9cef02101,

title = "Material characterization and failure analysis of through-silicon vias",

author = "Chenglin Wu and Tengfei Jiang and Jay Im and Liechti, \{Kenneth M.\} and Rui Huang and Ho, \{Paul S.\}",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014 ; Conference date: 30-06-2014 Through 04-07-2014",

year = "2014",

month = sep,

day = "12",

doi = "10.1109/IPFA.2014.6898206",

language = "English",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "312--316",

booktitle = "Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014",

}

TY - GEN

T1 - Material characterization and failure analysis of through-silicon vias

AU - Wu, Chenglin

AU - Jiang, Tengfei

AU - Im, Jay

AU - Liechti, Kenneth M.

AU - Huang, Rui

AU - Ho, Paul S.

PY - 2014/9/12

Y1 - 2014/9/12

UR - https://www.scopus.com/pages/publications/84908488795

UR - https://www.scopus.com/pages/publications/84908488795#tab=citedBy

U2 - 10.1109/IPFA.2014.6898206

DO - 10.1109/IPFA.2014.6898206

M3 - Conference contribution

AN - SCOPUS:84908488795

T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

SP - 312

EP - 316

BT - Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2014

Y2 - 30 June 2014 through 4 July 2014

ER -

Material characterization and failure analysis of through-silicon vias

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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