Large Scale Signal and Interconnect FDTD Modeling for BGA Package

Xiaohe Chen; James L. Drewniak; Jianmin Zhang; Michael A. Cracraft; Bruce Archambeault; Samuel R. Connor

doi:10.1109/EPEP.2006.321160

Large Scale Signal and Interconnect FDTD Modeling for BGA Package

Xiaohe Chen
, James L. Drewniak
, Jianmin Zhang
, Michael A. Cracraft
, Bruce Archambeault
, Samuel R. Connor

Research output: Contribution to journal › Article › peer-review

Abstract

This paper introduces a Finite-Difference Time-Domain (FDTD) approach to modeling portions of Ball Grid Array (BGA) package interconnect circuits. A fullwave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements.

Original language	American English
Journal	Proceedings of the IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging (2006, Scottsdale, AZ)
DOIs	https://doi.org/10.1109/EPEP.2006.321160
State	Published - Oct 1 2006

Keywords

Ball Grid Arrays
Finite Difference Time Domain Analysis
Integrated Circuit Interconnections
Integrated Circuit Modelling
Electric Currents
Electronics Packaging
Networks (Circuits)
Nonlinear Optics
(p,p,t) Measurements
Ball Grid Array (BGA) Packages
Circuit Modeling
Electrical Performances
Electronic Packaging
FDTD Modeling
Finite Difference Time Domain (FDTD-3D)
Gridding
Interconnect Circuits
Large Scales
Simulated Results
Finite Difference Time Domain Method

Disciplines

Electrical and Computer Engineering

Access to Document

10.1109/EPEP.2006.321160License: CC BY

Large Scale Signal and Interconnect FDTD Modeling for BGA PackageFinal published version, 3.36 MBLicense: CC BY

Cite this

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title = "Large Scale Signal and Interconnect FDTD Modeling for BGA Package",

abstract = " This paper introduces a Finite-Difference Time-Domain (FDTD) approach to modeling portions of Ball Grid Array (BGA) package interconnect circuits. A fullwave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements.",

keywords = "Ball Grid Arrays, Finite Difference Time Domain Analysis, Integrated Circuit Interconnections, Integrated Circuit Modelling, Electric Currents, Electronics Packaging, Networks (Circuits), Nonlinear Optics, (p,p,t) Measurements, Ball Grid Array (BGA) Packages, Circuit Modeling, Electrical Performances, Electronic Packaging, FDTD Modeling, Finite Difference Time Domain (FDTD-3D), Gridding, Interconnect Circuits, Large Scales, Simulated Results, Finite Difference Time Domain Method",

author = "Xiaohe Chen and Drewniak, \{James L.\} and Jianmin Zhang and Cracraft, \{Michael A.\} and Bruce Archambeault and Connor, \{Samuel R.\}",

year = "2006",

month = oct,

day = "1",

doi = "10.1109/EPEP.2006.321160",

language = "American English",

journal = "Proceedings of the IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging (2006, Scottsdale, AZ)",

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TY - JOUR

T1 - Large Scale Signal and Interconnect FDTD Modeling for BGA Package

AU - Chen, Xiaohe

AU - Drewniak, James L.

AU - Zhang, Jianmin

AU - Cracraft, Michael A.

AU - Archambeault, Bruce

AU - Connor, Samuel R.

PY - 2006/10/1

Y1 - 2006/10/1

N2 - This paper introduces a Finite-Difference Time-Domain (FDTD) approach to modeling portions of Ball Grid Array (BGA) package interconnect circuits. A fullwave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements.

AB - This paper introduces a Finite-Difference Time-Domain (FDTD) approach to modeling portions of Ball Grid Array (BGA) package interconnect circuits. A fullwave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements.

KW - Ball Grid Arrays

KW - Finite Difference Time Domain Analysis

KW - Integrated Circuit Interconnections

KW - Integrated Circuit Modelling

KW - Electric Currents

KW - Electronics Packaging

KW - Networks (Circuits)

KW - Nonlinear Optics

KW - (p,p,t) Measurements

KW - Ball Grid Array (BGA) Packages

KW - Circuit Modeling

KW - Electrical Performances

KW - Electronic Packaging

KW - FDTD Modeling

KW - Finite Difference Time Domain (FDTD-3D)

KW - Gridding

KW - Interconnect Circuits

KW - Large Scales

KW - Simulated Results

KW - Finite Difference Time Domain Method

UR - https://scholarsmine.mst.edu/ele_comeng_facwork/1104

U2 - 10.1109/EPEP.2006.321160

DO - 10.1109/EPEP.2006.321160

M3 - Article

JO - Proceedings of the IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging (2006, Scottsdale, AZ)

JF - Proceedings of the IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging (2006, Scottsdale, AZ)

ER -

Large Scale Signal and Interconnect FDTD Modeling for BGA Package

Abstract

Keywords

Disciplines

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