Kinetic analysis of the thermal degradation of printed wiring boards

Alex Luyima; Lifeng Zhang; Lucas Nana Wiredu Damoah

doi:10.1007/s11837-011-0134-y

Kinetic analysis of the thermal degradation of printed wiring boards

Alex Luyima
, Lifeng Zhang
, Lucas Nana Wiredu Damoah

Materials Science and Engineering

Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	33-37
Number of pages	5
Journal	JOM
Volume	63
Issue number	8
DOIs	https://doi.org/10.1007/s11837-011-0134-y
State	Published - Aug 2011

ASJC Scopus Subject Areas

General Materials Science
General Engineering

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title = "Kinetic analysis of the thermal degradation of printed wiring boards",

author = "Alex Luyima and Lifeng Zhang and Damoah, \{Lucas Nana Wiredu\}",

year = "2011",

month = aug,

doi = "10.1007/s11837-011-0134-y",

language = "English",

volume = "63",

pages = "33--37",

journal = "JOM",

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number = "8",

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AU - Luyima, Alex

AU - Zhang, Lifeng

AU - Damoah, Lucas Nana Wiredu

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JO - JOM

JF - JOM

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ER -

Kinetic analysis of the thermal degradation of printed wiring boards

ASJC Scopus Subject Areas

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