Investigation of crosstalk among vias

Songping Wu; Jun Fan

doi:10.1109/ISEMC.2009.5284637

Investigation of crosstalk among vias

Songping Wu
, Jun Fan

Electrical and Computer Engineering

Missouri University of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009
Pages	186-190
Number of pages	5
DOIs	https://doi.org/10.1109/ISEMC.2009.5284637
State	Published - 2009
Event	2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009 - Austin, TX, United States Duration: Aug 17 2009 → Aug 21 2009

Publication series

Name	IEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)	1077-4076

Conference

Conference	2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009
Country/Territory	United States
City	Austin, TX
Period	8/17/09 → 8/21/09

ASJC Scopus Subject Areas

Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/ISEMC.2009.5284637

Cite this

Wu, S & Fan, J 2009, Investigation of crosstalk among vias. in 2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009., 5284637, IEEE International Symposium on Electromagnetic Compatibility, pp. 186-190, 2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009, Austin, TX, United States, 8/17/09. https://doi.org/10.1109/ISEMC.2009.5284637

@inproceedings{f9dc7723d0d9434f9abce3f888c49c84,

title = "Investigation of crosstalk among vias",

author = "Songping Wu and Jun Fan",

year = "2009",

doi = "10.1109/ISEMC.2009.5284637",

language = "English",

isbn = "9781424442676",

series = "IEEE International Symposium on Electromagnetic Compatibility",

pages = "186--190",

booktitle = "2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009",

note = "2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009 ; Conference date: 17-08-2009 Through 21-08-2009",

}

TY - GEN

T1 - Investigation of crosstalk among vias

AU - Wu, Songping

AU - Fan, Jun

PY - 2009

Y1 - 2009

UR - https://www.scopus.com/pages/publications/74349106923

UR - https://www.scopus.com/pages/publications/74349106923#tab=citedBy

U2 - 10.1109/ISEMC.2009.5284637

DO - 10.1109/ISEMC.2009.5284637

M3 - Conference contribution

AN - SCOPUS:74349106923

SN - 9781424442676

T3 - IEEE International Symposium on Electromagnetic Compatibility

SP - 186

EP - 190

BT - 2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009

T2 - 2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009

Y2 - 17 August 2009 through 21 August 2009

ER -

Investigation of crosstalk among vias

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

Other files and links

Fingerprint

Cite this