Interfacial reaction between Sn-rich solders and Ni-based metallization

M. He; A. Kumar; P. T. Yeo; G. J. Qi; Z. Chen

doi:10.1016/j.tsf.2004.05.062

Interfacial reaction between Sn-rich solders and Ni-based metallization

M. He
, A. Kumar
, P. T. Yeo
, G. J. Qi
, Z. Chen

Nanyang Technological University
Agency for Science, Technology and Research, Singapore

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	387-394
Number of pages	8
Journal	Thin Solid Films
Volume	462-463
Issue number	SPEC. ISS.
DOIs	https://doi.org/10.1016/j.tsf.2004.05.062
State	Published - Sep 2004
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

Keywords

Electroless nickel
Intermetallic compound
Solder
Thermal aging

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10.1016/j.tsf.2004.05.062

Cite this

@article{b71e183ffaa14804a9a66fdc42a0ce2d,

title = "Interfacial reaction between Sn-rich solders and Ni-based metallization",

keywords = "Electroless nickel, Intermetallic compound, Solder, Thermal aging",

author = "M. He and A. Kumar and Yeo, \{P. T.\} and Qi, \{G. J.\} and Z. Chen",

year = "2004",

month = sep,

doi = "10.1016/j.tsf.2004.05.062",

language = "English",

volume = "462-463",

pages = "387--394",

journal = "Thin Solid Films",

issn = "0040-6090",

number = "SPEC. ISS.",

}

TY - JOUR

T1 - Interfacial reaction between Sn-rich solders and Ni-based metallization

AU - He, M.

AU - Kumar, A.

AU - Yeo, P. T.

AU - Qi, G. J.

AU - Chen, Z.

PY - 2004/9

Y1 - 2004/9

KW - Electroless nickel

KW - Intermetallic compound

KW - Solder

KW - Thermal aging

UR - https://www.scopus.com/pages/publications/4344575993

UR - https://www.scopus.com/pages/publications/4344575993#tab=citedBy

U2 - 10.1016/j.tsf.2004.05.062

DO - 10.1016/j.tsf.2004.05.062

M3 - Article

AN - SCOPUS:4344575993

SN - 0040-6090

VL - 462-463

SP - 387

EP - 394

JO - Thin Solid Films

JF - Thin Solid Films

IS - SPEC. ISS.

ER -

Interfacial reaction between Sn-rich solders and Ni-based metallization

ASJC Scopus Subject Areas

Keywords

Access to Document

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