@article{bd52d0ad17ad4736b8bb4b54c82f4263,
title = "Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5Ag reaction couple",
keywords = "Electroless Ni-P, ENIG, interfacial reaction, intermetallic compound, kinetics, lead-free solders, under bump metallization",
author = "Aditya Kumar and Zhong Chen",
year = "2011",
month = feb,
doi = "10.1007/s11664-010-1447-2",
language = "English",
volume = "40",
pages = "213--223",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
number = "2",
}