@article{96b2586039b94c4aab3ce83cb2da3018,
title = "Influence of phosphorus content on the interfacial microstructure between Sn-3.5Ag solder and electroless Ni-P metallization on Cu substrate",
keywords = "Electroless nickel, Interfacial reaction, Intermetallic spallation, Phosphorous content, Solder, Under bump metallization",
author = "Mona and Aditya Kumar and Zhong Chen",
year = "2007",
month = feb,
doi = "10.1109/TADVP.2006.879420",
language = "English",
volume = "30",
pages = "68--72",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
number = "1",
}