Impedance design for multi-layered vias

Xiaoxiong Gu; Albert E. Ruehli; Mark B. Ritter

doi:10.1109/EPEP.2008.4675944

Impedance design for multi-layered vias

Xiaoxiong Gu
, Albert E. Ruehli
, Mark B. Ritter

IBM

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Electrical Performance of Electronic Packaging, EPEP 2008
Pages	317-320
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2008.4675944
State	Published - 2008
Externally published	Yes
Event	17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 - San Jose, CA, United States Duration: Oct 27 2008 → Oct 29 2008

Publication series

Name	Electrical Performance of Electronic Packaging, EPEP

Conference

Conference	17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008
Country/Territory	United States
City	San Jose, CA
Period	10/27/08 → 10/29/08

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/EPEP.2008.4675944

Cite this

Gu, X, Ruehli, AE & Ritter, MB 2008, Impedance design for multi-layered vias. in Electrical Performance of Electronic Packaging, EPEP 2008., 4675944, Electrical Performance of Electronic Packaging, EPEP, pp. 317-320, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, San Jose, CA, United States, 10/27/08. https://doi.org/10.1109/EPEP.2008.4675944

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title = "Impedance design for multi-layered vias",

author = "Xiaoxiong Gu and Ruehli, \{Albert E.\} and Ritter, \{Mark B.\}",

year = "2008",

doi = "10.1109/EPEP.2008.4675944",

language = "English",

isbn = "9781424428731",

series = "Electrical Performance of Electronic Packaging, EPEP",

pages = "317--320",

booktitle = "Electrical Performance of Electronic Packaging, EPEP 2008",

note = "17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 ; Conference date: 27-10-2008 Through 29-10-2008",

}

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AU - Ruehli, Albert E.

AU - Ritter, Mark B.

PY - 2008

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U2 - 10.1109/EPEP.2008.4675944

DO - 10.1109/EPEP.2008.4675944

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AN - SCOPUS:58049129986

SN - 9781424428731

T3 - Electrical Performance of Electronic Packaging, EPEP

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BT - Electrical Performance of Electronic Packaging, EPEP 2008

T2 - 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008

Y2 - 27 October 2008 through 29 October 2008

ER -

Impedance design for multi-layered vias

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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Cite this