@article{0bd2a338fa4e455ba3d421197b74d8f2,
title = "Impact of grain structure and material properties on via extrusion in 3d interconnects",
keywords = "3D integratio, FEA, Interface, Microstructure, Via extrusion",
author = "Tengfei Jiang and Chenglin Wu and Jay Im and Rui Huang and Ho, \{Paul S.\}",
note = "Publisher Copyright: {\textcopyright} 2015 International Microelectronics Assembly and Packaging Society.",
year = "2015",
month = jul,
doi = "10.4071/imaps.456",
language = "English",
volume = "12",
pages = "118--122",
journal = "Journal of Microelectronics and Electronic Packaging",
issn = "1551-4897",
number = "3",
}