Skip to main navigation Skip to search Skip to main content

Immunity Enhancement of the Power Distribution Network in Integrated Circuits with Coplanar Meander Lines in Package

  • Samsung
  • Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

Original languageEnglish
Article number8959385
Pages (from-to)2238-2246
Number of pages9
JournalIEEE Transactions on Electromagnetic Compatibility
Volume62
Issue number5
DOIs
StatePublished - Oct 2020

ASJC Scopus Subject Areas

  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Keywords

  • Band-stop filter
  • coplanar meander lines
  • immunity
  • integrated circuits (ICs)
  • interposer
  • package
  • power distribution network (PDN)

Fingerprint

Dive into the research topics of 'Immunity Enhancement of the Power Distribution Network in Integrated Circuits with Coplanar Meander Lines in Package'. Together they form a unique fingerprint.

Cite this