High-Speed Serial Link Challenges using Multi-Level Signaling

Nana Dikhaminjia; Junping He; E. Hernandez; Mikheil Tsiklauri; James L. Drewniak; Arun Reddy Chada; Mikhail Zvonkin; Bhyrav Mutnury

doi:10.1109/EPEPS.2015.7347129

High-Speed Serial Link Challenges using Multi-Level Signaling

Nana Dikhaminjia
, Junping He
, E. Hernandez
, Mikheil Tsiklauri
, James L. Drewniak
, Arun Reddy Chada
, Mikhail Zvonkin
, Bhyrav Mutnury

Electrical and Computer Engineering

Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.

Original language	American English
Journal	Proceedings of the 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015, San Jose, CA)
DOIs	https://doi.org/10.1109/EPEPS.2015.7347129
State	Published - Dec 1 2015

Keywords

Electronics packaging
High speed serial links
Jitter
Lossy materials
Multi-level signaling
NRZ
PAM4
Various Channels
equalization

Disciplines

Electrical and Computer Engineering

Access to Document

10.1109/EPEPS.2015.7347129License: Unspecified

https://doi.org/10.1109/EPEPS.2015.7347129

Cite this

@article{829cb8e8ddfd4be280701efb095f8a53,

title = "High-Speed Serial Link Challenges using Multi-Level Signaling",

abstract = " The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.",

keywords = "Electronics packaging, High speed serial links, Jitter, Lossy materials, Multi-level signaling, NRZ, PAM4, Various Channels, equalization",

author = "Nana Dikhaminjia and Junping He and E. Hernandez and Mikheil Tsiklauri and Drewniak, \{James L.\} and Chada, \{Arun Reddy\} and Mikhail Zvonkin and Bhyrav Mutnury",

year = "2015",

month = dec,

day = "1",

doi = "10.1109/EPEPS.2015.7347129",

language = "American English",

journal = "Proceedings of the 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015, San Jose, CA)",

}

TY - JOUR

T1 - High-Speed Serial Link Challenges using Multi-Level Signaling

AU - Dikhaminjia, Nana

AU - He, Junping

AU - Hernandez, E.

AU - Tsiklauri, Mikheil

AU - Drewniak, James L.

AU - Chada, Arun Reddy

AU - Zvonkin, Mikhail

AU - Mutnury, Bhyrav

PY - 2015/12/1

Y1 - 2015/12/1

N2 - The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.

AB - The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.

KW - Electronics packaging

KW - High speed serial links

KW - Jitter

KW - Lossy materials

KW - Multi-level signaling

KW - NRZ

KW - PAM4

KW - Various Channels

KW - equalization

UR - https://scholarsmine.mst.edu/ele_comeng_facwork/2133

UR - https://doi.org/10.1109/EPEPS.2015.7347129

U2 - 10.1109/EPEPS.2015.7347129

DO - 10.1109/EPEPS.2015.7347129

M3 - Article

JO - Proceedings of the 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015, San Jose, CA)

JF - Proceedings of the 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015, San Jose, CA)

ER -

High-Speed Serial Link Challenges using Multi-Level Signaling

Abstract

Keywords

Disciplines

Access to Document

Other files and links

Fingerprint

Cite this