High-speed Channel Simulator using Neural Language Models

Hyunwook Park; Yifan Ding; Ling Zhang; Natalia Bondarenko; Hanqin Ye; Brice Achkir; Chulsoon Hwang

doi:10.1109/EMCSIPI49824.2024.10705639

High-speed Channel Simulator using Neural Language Models

Hyunwook Park
, Yifan Ding
, Ling Zhang
, Natalia Bondarenko
, Hanqin Ye
, Brice Achkir
, Chulsoon Hwang

Electrical and Computer Engineering

Missouri University of Science and Technology
Zhejiang University
Cisco Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	11-16
Number of pages	6
ISBN (Electronic)	9798350360394
DOIs	https://doi.org/10.1109/EMCSIPI49824.2024.10705639
State	Published - 2024
Event	2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024 - Phoenix, United States Duration: Aug 5 2024 → Aug 9 2024

Publication series

Name	IEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)	1077-4076
ISSN (Electronic)	2158-1118

Conference

Conference	2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024
Country/Territory	United States
City	Phoenix
Period	8/5/24 → 8/9/24

ASJC Scopus Subject Areas

Condensed Matter Physics
Electrical and Electronic Engineering

Keywords

High-speed channel
Neural language model
Signal integrity
Transformer network

Access to Document

10.1109/EMCSIPI49824.2024.10705639

Cite this

Park, H., Ding, Y., Zhang, L., Bondarenko, N., Ye, H., Achkir, B., & Hwang, C. (2024). High-speed Channel Simulator using Neural Language Models. In 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024 (pp. 11-16). (IEEE International Symposium on Electromagnetic Compatibility). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMCSIPI49824.2024.10705639

High-speed Channel Simulator using Neural Language Models. / Park, Hyunwook; Ding, Yifan; Zhang, Ling et al.
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. Institute of Electrical and Electronics Engineers Inc., 2024. p. 11-16 (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Park, H, Ding, Y, Zhang, L, Bondarenko, N, Ye, H, Achkir, B & Hwang, C 2024, High-speed Channel Simulator using Neural Language Models. in 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. IEEE International Symposium on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers Inc., pp. 11-16, 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024, Phoenix, United States, 8/5/24. https://doi.org/10.1109/EMCSIPI49824.2024.10705639

Park H, Ding Y, Zhang L, Bondarenko N, Ye H, Achkir B et al. High-speed Channel Simulator using Neural Language Models. In 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024. Institute of Electrical and Electronics Engineers Inc. 2024. p. 11-16. (IEEE International Symposium on Electromagnetic Compatibility). doi: 10.1109/EMCSIPI49824.2024.10705639

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title = "High-speed Channel Simulator using Neural Language Models",

keywords = "High-speed channel, Neural language model, Signal integrity, Transformer network",

author = "Hyunwook Park and Yifan Ding and Ling Zhang and Natalia Bondarenko and Hanqin Ye and Brice Achkir and Chulsoon Hwang",

note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024 ; Conference date: 05-08-2024 Through 09-08-2024",

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AU - Park, Hyunwook

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AU - Ye, Hanqin

AU - Achkir, Brice

AU - Hwang, Chulsoon

PY - 2024

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KW - Transformer network

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M3 - Conference contribution

AN - SCOPUS:85207839050

T3 - IEEE International Symposium on Electromagnetic Compatibility

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EP - 16

BT - 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024

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Y2 - 5 August 2024 through 9 August 2024

ER -

High-speed Channel Simulator using Neural Language Models

Publication series

Conference

ASJC Scopus Subject Areas

Keywords

Access to Document

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Cite this