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GPU-Accelerated HO-SIE-DDM Using NVIDIA CUDA for Analysis of Multiscale Problems

  • Tao Zhou
  • , Qiang Ming Cai
  • , Xin Cao
  • , Wen Jiang
  • , Yuying Zhu
  • , Yuyu Zhu
  • , Jun Fan
  • Southwest University of Science and Technology
  • Ltd.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original languageEnglish
Title of host publication2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages201-203
Number of pages3
ISBN (Electronic)9781665416719
DOIs
StatePublished - 2022
Externally publishedYes
Event13th Asia-Pacific International Symposium on Electromagnetic Compatibility and Technical Exhibition, APEMC 2022 - Beijing, China
Duration: Sep 1 2022 → Sep 4 2022

Publication series

Name2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022

Conference

Conference13th Asia-Pacific International Symposium on Electromagnetic Compatibility and Technical Exhibition, APEMC 2022
Country/TerritoryChina
CityBeijing
Period9/1/22 → 9/4/22

ASJC Scopus Subject Areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Radiation

Keywords

  • Compute Unified Device Architecture (CUDA)
  • Domain decomposition method (DDM)
  • graphic processing unit (GPU)
  • higher order hierarchical vector (HOHV) basis functions
  • surface integral equation (SIE)

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