Fullwave simulation and validation of a complex packaging structure

B. Archambeault; S. Connor; Daniel N. De Araujo; A. Ruehli; C. Schuster

doi:10.1109/ECTC.2006.1645816

Fullwave simulation and validation of a complex packaging structure

B. Archambeault
, S. Connor
, Daniel N. De Araujo
, A. Ruehli
, C. Schuster

IBM

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Proceedings - IEEE 56th Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1268-1273
Number of pages	6
ISBN (Print)	1424401526, 9781424401529
DOIs	https://doi.org/10.1109/ECTC.2006.1645816
State	Published - 2006
Externally published	Yes
Event	IEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States Duration: May 30 2006 → Jun 2 2006

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2006
ISSN (Print)	0569-5503

Conference

Conference	IEEE 56th Electronic Components and Technology Conference
Country/Territory	United States
City	San Diego, CA
Period	5/30/06 → 6/2/06

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2006.1645816

Cite this

Archambeault, B., Connor, S., De Araujo, D. N., Ruehli, A., & Schuster, C. (2006). Fullwave simulation and validation of a complex packaging structure. In Proceedings - IEEE 56th Electronic Components and Technology Conference (pp. 1268-1273). Article 1645816 (Proceedings - Electronic Components and Technology Conference; Vol. 2006). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2006.1645816

Fullwave simulation and validation of a complex packaging structure. / Archambeault, B.; Connor, S.; De Araujo, Daniel N. et al.
Proceedings - IEEE 56th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2006. p. 1268-1273 1645816 (Proceedings - Electronic Components and Technology Conference; Vol. 2006).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Archambeault, B, Connor, S, De Araujo, DN, Ruehli, A & Schuster, C 2006, Fullwave simulation and validation of a complex packaging structure. in Proceedings - IEEE 56th Electronic Components and Technology Conference., 1645816, Proceedings - Electronic Components and Technology Conference, vol. 2006, Institute of Electrical and Electronics Engineers Inc., pp. 1268-1273, IEEE 56th Electronic Components and Technology Conference, San Diego, CA, United States, 5/30/06. https://doi.org/10.1109/ECTC.2006.1645816

Archambeault B, Connor S, De Araujo DN, Ruehli A, Schuster C. Fullwave simulation and validation of a complex packaging structure. In Proceedings - IEEE 56th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc. 2006. p. 1268-1273. 1645816. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2006.1645816

@inproceedings{0c381244085543e6b7f416144a43a13d,

title = "Fullwave simulation and validation of a complex packaging structure",

author = "B. Archambeault and S. Connor and \{De Araujo\}, \{Daniel N.\} and A. Ruehli and C. Schuster",

year = "2006",

doi = "10.1109/ECTC.2006.1645816",

language = "English",

isbn = "1424401526",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1268--1273",

booktitle = "Proceedings - IEEE 56th Electronic Components and Technology Conference",

note = "IEEE 56th Electronic Components and Technology Conference ; Conference date: 30-05-2006 Through 02-06-2006",

}

TY - GEN

T1 - Fullwave simulation and validation of a complex packaging structure

AU - Archambeault, B.

AU - Connor, S.

AU - De Araujo, Daniel N.

AU - Ruehli, A.

AU - Schuster, C.

PY - 2006

Y1 - 2006

UR - https://www.scopus.com/pages/publications/33845567088

UR - https://www.scopus.com/pages/publications/33845567088#tab=citedBy

U2 - 10.1109/ECTC.2006.1645816

DO - 10.1109/ECTC.2006.1645816

M3 - Conference contribution

AN - SCOPUS:33845567088

SN - 1424401526

SN - 9781424401529

T3 - Proceedings - Electronic Components and Technology Conference

SP - 1268

EP - 1273

BT - Proceedings - IEEE 56th Electronic Components and Technology Conference

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - IEEE 56th Electronic Components and Technology Conference

Y2 - 30 May 2006 through 2 June 2006

ER -

Fullwave simulation and validation of a complex packaging structure

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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