Abstract
PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling.
| Original language | American English |
|---|---|
| Pages (from-to) | 135-140 |
| Number of pages | 6 |
| Journal | Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2000, Washington, D.C.) |
| Volume | 1 |
| DOIs | |
| State | Published - Aug 1 2000 |
| Event | 2000 IEEE International Symposium on Electromagneti Compatibility - Washington, DC, USA Duration: Aug 21 2000 → Aug 25 2000 |
ASJC Scopus Subject Areas
- Condensed Matter Physics
- Electrical and Electronic Engineering
Keywords
- EMI Problems
- FDTD Modeling
- FEM/MOM Modeling
- PCB Edge
- PCB Layout
- PCB Traces
- Design Maxims
- Electromagnetic Interference
- Experiment
- Finite Difference Time-Domain Analysis
- Finite Element Analysis
- High Frequency Components
- High-Speed Signals
- Method of Moments
- Numerical Modeling
- Printed Circuit Design
- Printed Circuit Layout
- Trace Routing
Disciplines
- Electrical and Computer Engineering
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