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FDTD and FEM/MOM Modeling of EMI Resulting from a Trace Near a PCB Edge

  • Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling.

Original languageAmerican English
Pages (from-to)135-140
Number of pages6
JournalProceedings of the IEEE International Symposium on Electromagnetic Compatibility (2000, Washington, D.C.)
Volume1
DOIs
StatePublished - Aug 1 2000
Event2000 IEEE International Symposium on Electromagneti Compatibility - Washington, DC, USA
Duration: Aug 21 2000 → Aug 25 2000

ASJC Scopus Subject Areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Keywords

  • EMI Problems
  • FDTD Modeling
  • FEM/MOM Modeling
  • PCB Edge
  • PCB Layout
  • PCB Traces
  • Design Maxims
  • Electromagnetic Interference
  • Experiment
  • Finite Difference Time-Domain Analysis
  • Finite Element Analysis
  • High Frequency Components
  • High-Speed Signals
  • Method of Moments
  • Numerical Modeling
  • Printed Circuit Design
  • Printed Circuit Layout
  • Trace Routing

Disciplines

  • Electrical and Computer Engineering

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