Factors affecting the mechanical properties of Cu/electroless Ni-P/Sn-3.5Ag solder joints

Aditya Kumar; Zhong Chen; C. C. Wong; S. G. Mhaisalkar; Vaidhyanathan Kripesh

Factors affecting the mechanical properties of Cu/electroless Ni-P/Sn-3.5Ag solder joints

Aditya Kumar
, Zhong Chen
, C. C. Wong
, S. G. Mhaisalkar
, Vaidhyanathan Kripesh

Nanyang Technological University
Agency for Science, Technology and Research, Singapore

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Advanced Electronic Packaging
Pages	117-123
Number of pages	7
State	Published - 2007
Externally published	Yes
Event	2006 MRS Fall Meeting - Boston, MA, United States Duration: Nov 26 2006 → Nov 30 2006

Publication series

Name	Materials Research Society Symposium Proceedings
Volume	968
ISSN (Print)	0272-9172

Conference

Conference	2006 MRS Fall Meeting
Country/Territory	United States
City	Boston, MA
Period	11/26/06 → 11/30/06

ASJC Scopus Subject Areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Cite this

@inproceedings{c7472b1270664f59944a6909b9f7cac4,

title = "Factors affecting the mechanical properties of Cu/electroless Ni-P/Sn-3.5Ag solder joints",

author = "Aditya Kumar and Zhong Chen and Wong, \{C. C.\} and Mhaisalkar, \{S. G.\} and Vaidhyanathan Kripesh",

year = "2007",

language = "English",

isbn = "1558999256",

series = "Materials Research Society Symposium Proceedings",

pages = "117--123",

booktitle = "Advanced Electronic Packaging",

note = "2006 MRS Fall Meeting ; Conference date: 26-11-2006 Through 30-11-2006",

}

TY - GEN

T1 - Factors affecting the mechanical properties of Cu/electroless Ni-P/Sn-3.5Ag solder joints

AU - Kumar, Aditya

AU - Chen, Zhong

AU - Wong, C. C.

AU - Mhaisalkar, S. G.

AU - Kripesh, Vaidhyanathan

PY - 2007

Y1 - 2007

UR - https://www.scopus.com/pages/publications/34250804718

UR - https://www.scopus.com/pages/publications/34250804718#tab=citedBy

M3 - Conference contribution

AN - SCOPUS:34250804718

SN - 1558999256

SN - 9781558999251

T3 - Materials Research Society Symposium Proceedings

SP - 117

EP - 123

BT - Advanced Electronic Packaging

T2 - 2006 MRS Fall Meeting

Y2 - 26 November 2006 through 30 November 2006

ER -

Factors affecting the mechanical properties of Cu/electroless Ni-P/Sn-3.5Ag solder joints

Publication series

Conference

ASJC Scopus Subject Areas

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Cite this