Extraction of via-plate capacitance of an eccentric via by an integral approximation method

Yaojiang Zhang; Renato Rimolo-Donadio; Jun Fan; Christian Schuster; Erping Li

doi:10.1109/LMWC.2009.2017587

Extraction of via-plate capacitance of an eccentric via by an integral approximation method

Yaojiang Zhang
, Renato Rimolo-Donadio
, Jun Fan
, Christian Schuster
, Erping Li

Electrical and Computer Engineering

Missouri University of Science and Technology
Agency for Science, Technology and Research, Singapore
Hamburg University of Technology

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	4840543
Pages (from-to)	275-277
Number of pages	3
Journal	IEEE Microwave and Wireless Components Letters
Volume	19
Issue number	5
DOIs	https://doi.org/10.1109/LMWC.2009.2017587
State	Published - May 2009

ASJC Scopus Subject Areas

Condensed Matter Physics
Electrical and Electronic Engineering

Keywords

Eccentric vias
Printed circuit board (PCB)
Signal integrity (SI)
Via-plate capacitance

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10.1109/LMWC.2009.2017587

Cite this

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title = "Extraction of via-plate capacitance of an eccentric via by an integral approximation method",

keywords = "Eccentric vias, Printed circuit board (PCB), Signal integrity (SI), Via-plate capacitance",

author = "Yaojiang Zhang and Renato Rimolo-Donadio and Jun Fan and Christian Schuster and Erping Li",

year = "2009",

month = may,

doi = "10.1109/LMWC.2009.2017587",

language = "English",

volume = "19",

pages = "275--277",

journal = "IEEE Microwave and Wireless Components Letters",

issn = "1531-1309",

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AU - Zhang, Yaojiang

AU - Rimolo-Donadio, Renato

AU - Fan, Jun

AU - Schuster, Christian

AU - Li, Erping

PY - 2009/5

Y1 - 2009/5

KW - Eccentric vias

KW - Printed circuit board (PCB)

KW - Signal integrity (SI)

KW - Via-plate capacitance

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UR - https://www.scopus.com/pages/publications/67649233104#tab=citedBy

U2 - 10.1109/LMWC.2009.2017587

DO - 10.1109/LMWC.2009.2017587

M3 - Article

AN - SCOPUS:67649233104

SN - 1531-1309

VL - 19

SP - 275

EP - 277

JO - IEEE Microwave and Wireless Components Letters

JF - IEEE Microwave and Wireless Components Letters

IS - 5

M1 - 4840543

ER -

Extraction of via-plate capacitance of an eccentric via by an integral approximation method

ASJC Scopus Subject Areas

Keywords

Access to Document

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