@inproceedings{493ff3648b7d45adbec614f2f0fd9149,
title = "Experimental Study of PCB Vibration Induced by MLCC Assembly Orientation and Process Variations",
keywords = "deformation, equivalent source, Multilayer ceramic capacitor (MLCC), piezoelectric characteristic, power noise, vibration velocity",
author = "Yifan Ding and Xue, \{Ming Feng\} and Jianmin Zhang and Xin Hua and Benjamin Leung and MacIntosh, \{Eric A.\} and Chulsoon Hwang",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024 ; Conference date: 05-08-2024 Through 09-08-2024",
year = "2024",
doi = "10.1109/EMCSIPI49824.2024.10705552",
language = "English",
series = "IEEE International Symposium on Electromagnetic Compatibility",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "110--113",
booktitle = "2024 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2024",
}