Abstract
Shared-antipad via structure is commonly used for high-speed printed circuit board (PCB) design. Therefore, an accurate via-plane capacitance evaluation for this kind of geometry is critical to facilitate engineering design. In this paper, the analytical equation of via-plane capacitance for separated-antipad via structure is extended to the shared-antipad via structure case, by using the equivalent area of antipad and ratio revision method. The proposed method is validated with numerical methods in HFSS for a typical structure widely used in practical high-speed PCB design.
| Original language | American English |
|---|---|
| Journal | Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (2017, Washington, DC) |
| DOIs | |
| State | Published - Aug 1 2017 |
Keywords
- Analytical equations
- Capacitance
- Electromagnetic compatibility
- Engineering design
- High-speed channels
- Numerical methods
- PCB design
- Physic-based via model
- Printed circuit board designs
- Printed circuit boards
- Printed circuit design
- Separated-antipad via structure
- Structural design
- Typical structures
- Via modeling
- Via-barrel capacitances
- Via-plane capacitance
Disciplines
- Electrical and Computer Engineering
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