EMI benefits of ground plane stitching in multi-layer power bus stacks

Xiaoning Ye; David M. Hockanson; Min Li; Wei Cui; Sergiu Radu; James L. Drewniak; Thomas P. VanDoren; Todd H. Hubing; Richard E. DuBroff

EMI benefits of ground plane stitching in multi-layer power bus stacks

Xiaoning Ye
, David M. Hockanson
, Min Li
, Wei Cui
, Sergiu Radu
, James L. Drewniak
, Thomas P. VanDoren
, Todd H. Hubing
, Richard E. DuBroff

Electrical and Computer Engineering

Missouri University of Science and Technology

Research output: Contribution to journal › Conference article › peer-review

Original language	English
Pages (from-to)	833-838
Number of pages	6
Journal	IEEE International Symposium on Electromagnetic Compatibility
Volume	2
State	Published - 2000
Event	2000 IEEE International Symposium on Electronic Compatibility - Washington, DC, USA Duration: Aug 21 2000 → Aug 25 2000

ASJC Scopus Subject Areas

Condensed Matter Physics
Electrical and Electronic Engineering

Cite this

@article{155e3f3fae754da4913295e8accd6dfb,

title = "EMI benefits of ground plane stitching in multi-layer power bus stacks",

author = "Xiaoning Ye and Hockanson, \{David M.\} and Min Li and Wei Cui and Sergiu Radu and Drewniak, \{James L.\} and VanDoren, \{Thomas P.\} and Hubing, \{Todd H.\} and DuBroff, \{Richard E.\}",

year = "2000",

language = "English",

volume = "2",

pages = "833--838",

journal = "IEEE International Symposium on Electromagnetic Compatibility",

issn = "0190-1494",

note = "2000 IEEE International Symposium on Electronic Compatibility ; Conference date: 21-08-2000 Through 25-08-2000",

}

TY - JOUR

T1 - EMI benefits of ground plane stitching in multi-layer power bus stacks

AU - Ye, Xiaoning

AU - Hockanson, David M.

AU - Li, Min

AU - Cui, Wei

AU - Radu, Sergiu

AU - Drewniak, James L.

AU - VanDoren, Thomas P.

AU - Hubing, Todd H.

AU - DuBroff, Richard E.

PY - 2000

Y1 - 2000

UR - https://www.scopus.com/pages/publications/0033681036

UR - https://www.scopus.com/pages/publications/0033681036#tab=citedBy

M3 - Conference article

AN - SCOPUS:0033681036

SN - 0190-1494

VL - 2

SP - 833

EP - 838

JO - IEEE International Symposium on Electromagnetic Compatibility

JF - IEEE International Symposium on Electromagnetic Compatibility

T2 - 2000 IEEE International Symposium on Electronic Compatibility

Y2 - 21 August 2000 through 25 August 2000

ER -

EMI benefits of ground plane stitching in multi-layer power bus stacks

ASJC Scopus Subject Areas

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