Embedded wafer level packages with laterally placed and vertically stacked thin dies

Gaurav Sharma; Vempati Srinivas Rao; Aditya Kumar; Nandar Su; Lim Ying; Khong Chee Houe; Sharon Lim; Vasarla Nagendra Sekhar; Ranjan Rajoo; Vaidyanathan Kripesh; John H. Lau

doi:10.1109/ECTC.2009.5074217

Embedded wafer level packages with laterally placed and vertically stacked thin dies

Gaurav Sharma
, Vempati Srinivas Rao
, Aditya Kumar
, Nandar Su
, Lim Ying
, Khong Chee Houe
, Sharon Lim
, Vasarla Nagendra Sekhar
, Ranjan Rajoo
, Vaidyanathan Kripesh
, John H. Lau

Agency for Science, Technology and Research, Singapore
Hong Kong University of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
Pages	1537-1543
Number of pages	7
DOIs	https://doi.org/10.1109/ECTC.2009.5074217
State	Published - 2009
Externally published	Yes
Event	2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States Duration: May 26 2009 → May 29 2009

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2009 59th Electronic Components and Technology Conference, ECTC 2009
Country/Territory	United States
City	San Diego, CA
Period	5/26/09 → 5/29/09

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2009.5074217

Cite this

Sharma, G., Rao, V. S., Kumar, A., Su, N., Ying, L., Houe, K. C., Lim, S., Sekhar, V. N., Rajoo, R., Kripesh, V., & Lau, J. H. (2009). Embedded wafer level packages with laterally placed and vertically stacked thin dies. In 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009 (pp. 1537-1543). Article 5074217 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2009.5074217

Embedded wafer level packages with laterally placed and vertically stacked thin dies. / Sharma, Gaurav; Rao, Vempati Srinivas; Kumar, Aditya et al.
2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. 2009. p. 1537-1543 5074217 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Sharma, G, Rao, VS, Kumar, A, Su, N, Ying, L, Houe, KC, Lim, S, Sekhar, VN, Rajoo, R, Kripesh, V & Lau, JH 2009, Embedded wafer level packages with laterally placed and vertically stacked thin dies. in 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009., 5074217, Proceedings - Electronic Components and Technology Conference, pp. 1537-1543, 2009 59th Electronic Components and Technology Conference, ECTC 2009, San Diego, CA, United States, 5/26/09. https://doi.org/10.1109/ECTC.2009.5074217

@inproceedings{53978160407b4fa5919dacf36d3f7d6d,

title = "Embedded wafer level packages with laterally placed and vertically stacked thin dies",

author = "Gaurav Sharma and Rao, \{Vempati Srinivas\} and Aditya Kumar and Nandar Su and Lim Ying and Houe, \{Khong Chee\} and Sharon Lim and Sekhar, \{Vasarla Nagendra\} and Ranjan Rajoo and Vaidyanathan Kripesh and Lau, \{John H.\}",

year = "2009",

doi = "10.1109/ECTC.2009.5074217",

language = "English",

isbn = "9781424444762",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "1537--1543",

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AU - Sharma, Gaurav

AU - Rao, Vempati Srinivas

AU - Kumar, Aditya

AU - Su, Nandar

AU - Ying, Lim

AU - Houe, Khong Chee

AU - Lim, Sharon

AU - Sekhar, Vasarla Nagendra

AU - Rajoo, Ranjan

AU - Kripesh, Vaidyanathan

AU - Lau, John H.

PY - 2009

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DO - 10.1109/ECTC.2009.5074217

M3 - Conference contribution

AN - SCOPUS:70349666681

SN - 9781424444762

T3 - Proceedings - Electronic Components and Technology Conference

SP - 1537

EP - 1543

BT - 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009

T2 - 2009 59th Electronic Components and Technology Conference, ECTC 2009

Y2 - 26 May 2009 through 29 May 2009

ER -

Embedded wafer level packages with laterally placed and vertically stacked thin dies

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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