Electromagnetic Simulation For Inhomogeneous Interconnect And Packaging Structures

Lijun Jiang; Barry J. Rubin; Yuan Liu; Jason D. Morsey; Alina Deustch

doi:10.1109/EPEP.2007.4387202

Electromagnetic Simulation For Inhomogeneous Interconnect And Packaging Structures

Lijun Jiang
, Barry J. Rubin
, Yuan Liu
, Jason D. Morsey
, Alina Deustch

Missouri University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

The paper contains a novel mechanism for full wave electromagnetic simulation of complicated inhomogeneous structures, such as on-chip interconnects, IC packaging, antennas, and scattering objects. It uses only Equivalent Principle based EFIE instead of both EFIE and MFIE to establish the surface integral equations for practical inhomogeneous structure so that a much more simplified formulation process is needed in the EM simulation procedure. To overcome the numerical error of K operator in the formulation, a new analytical solution to the K operator for general full-wave integral equations is provided. Numerical results are demonstrated to verify the proposed algorithm. © 2007 IEEE.

Original language	American English
Journal	IEEE Topical Meeting on Electrical Performance of Electronic Packaging
DOIs	https://doi.org/10.1109/EPEP.2007.4387202
State	Published - Dec 1 2007

Disciplines

Electrical and Computer Engineering

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Cite this

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title = "Electromagnetic Simulation For Inhomogeneous Interconnect And Packaging Structures",

abstract = " The paper contains a novel mechanism for full wave electromagnetic simulation of complicated inhomogeneous structures, such as on-chip interconnects, IC packaging, antennas, and scattering objects. It uses only Equivalent Principle based EFIE instead of both EFIE and MFIE to establish the surface integral equations for practical inhomogeneous structure so that a much more simplified formulation process is needed in the EM simulation procedure. To overcome the numerical error of K operator in the formulation, a new analytical solution to the K operator for general full-wave integral equations is provided. Numerical results are demonstrated to verify the proposed algorithm. {\textcopyright} 2007 IEEE.",

author = "Lijun Jiang and Rubin, \{Barry J.\} and Yuan Liu and Morsey, \{Jason D.\} and Alina Deustch",

year = "2007",

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doi = "10.1109/EPEP.2007.4387202",

language = "American English",

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AU - Jiang, Lijun

AU - Rubin, Barry J.

AU - Liu, Yuan

AU - Morsey, Jason D.

AU - Deustch, Alina

PY - 2007/12/1

Y1 - 2007/12/1

N2 - The paper contains a novel mechanism for full wave electromagnetic simulation of complicated inhomogeneous structures, such as on-chip interconnects, IC packaging, antennas, and scattering objects. It uses only Equivalent Principle based EFIE instead of both EFIE and MFIE to establish the surface integral equations for practical inhomogeneous structure so that a much more simplified formulation process is needed in the EM simulation procedure. To overcome the numerical error of K operator in the formulation, a new analytical solution to the K operator for general full-wave integral equations is provided. Numerical results are demonstrated to verify the proposed algorithm. © 2007 IEEE.

AB - The paper contains a novel mechanism for full wave electromagnetic simulation of complicated inhomogeneous structures, such as on-chip interconnects, IC packaging, antennas, and scattering objects. It uses only Equivalent Principle based EFIE instead of both EFIE and MFIE to establish the surface integral equations for practical inhomogeneous structure so that a much more simplified formulation process is needed in the EM simulation procedure. To overcome the numerical error of K operator in the formulation, a new analytical solution to the K operator for general full-wave integral equations is provided. Numerical results are demonstrated to verify the proposed algorithm. © 2007 IEEE.

UR - https://scholarsmine.mst.edu/ele_comeng_facwork/5410

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DO - 10.1109/EPEP.2007.4387202

M3 - Article

JO - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

JF - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

ER -

Electromagnetic Simulation For Inhomogeneous Interconnect And Packaging Structures

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