Effective roughness dielectric to represent copper foil roughness in printed circuit boards 14-TH4

Research output: Contribution to conference › Paper › peer-review

Original language	English
State	Published - 2015
Externally published	Yes
Event	DesignCon 2015 - Santa Clara, United States Duration: Jan 27 2015 → Jan 30 2015

ASJC Scopus Subject Areas

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title = "Effective roughness dielectric to represent copper foil roughness in printed circuit boards 14-TH4",

author = "Marina Koledintseva and Oleg Kashurkin and Tracey Vincent and Scott Hinaga",

year = "2015",

language = "English",

note = "DesignCon 2015 ; Conference date: 27-01-2015 Through 30-01-2015",

}

TY - CONF

T1 - Effective roughness dielectric to represent copper foil roughness in printed circuit boards 14-TH4

AU - Koledintseva, Marina

AU - Kashurkin, Oleg

AU - Vincent, Tracey

AU - Hinaga, Scott

PY - 2015

Y1 - 2015

UR - https://www.scopus.com/pages/publications/84983123413

UR - https://www.scopus.com/pages/publications/84983123413#tab=citedBy

M3 - Paper

AN - SCOPUS:84983123413

T2 - DesignCon 2015

Y2 - 27 January 2015 through 30 January 2015

ER -