Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

Jianyong Xie; Daehyun Chung; Madhavan Swaminathan; Michael Mcallister; Alina Deutsch; Lijun Jiang; Barry J. Rubin

doi:10.1109/EPEPS.2009.5338465

Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

Jianyong Xie
, Daehyun Chung
, Madhavan Swaminathan
, Michael Mcallister
, Alina Deutsch
, Lijun Jiang
, Barry J. Rubin

Georgia Institute of Technology
IBM

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
Pages	113-116
Number of pages	4
DOIs	https://doi.org/10.1109/EPEPS.2009.5338465
State	Published - 2009
Externally published	Yes
Event	2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 - Portland, OR, United States Duration: Oct 19 2009 → Oct 21 2009

Publication series

Name	2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

Conference

Conference	2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
Country/Territory	United States
City	Portland, OR
Period	10/19/09 → 10/21/09

ASJC Scopus Subject Areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/EPEPS.2009.5338465

Cite this

Xie, J., Chung, D., Swaminathan, M., Mcallister, M., Deutsch, A., Jiang, L., & Rubin, B. J. (2009). Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. In 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 (pp. 113-116). Article 5338465 (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09). https://doi.org/10.1109/EPEPS.2009.5338465

Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. / Xie, Jianyong; Chung, Daehyun; Swaminathan, Madhavan et al.
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. 2009. p. 113-116 5338465 (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Xie, J, Chung, D, Swaminathan, M, Mcallister, M, Deutsch, A, Jiang, L & Rubin, BJ 2009, Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09., 5338465, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp. 113-116, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, Portland, OR, United States, 10/19/09. https://doi.org/10.1109/EPEPS.2009.5338465

Xie J, Chung D, Swaminathan M, Mcallister M, Deutsch A, Jiang L et al. Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. In 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. 2009. p. 113-116. 5338465. (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09). doi: 10.1109/EPEPS.2009.5338465

Xie, Jianyong ; Chung, Daehyun ; Swaminathan, Madhavan et al. / Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. 2009. pp. 113-116 (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09).

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title = "Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration",

author = "Jianyong Xie and Daehyun Chung and Madhavan Swaminathan and Michael Mcallister and Alina Deutsch and Lijun Jiang and Rubin, \{Barry J.\}",

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AU - Xie, Jianyong

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AU - Jiang, Lijun

AU - Rubin, Barry J.

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Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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