Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Aditya Kumar; Zhong Chen

Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Aditya Kumar
, Zhong Chen

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Pages	873-878
Number of pages	6
State	Published - 2005
Externally published	Yes
Event	7th Electronics Packaging Technology Conference, EPTC 2005 - Singapore, Singapore Duration: Dec 7 2005 → Dec 9 2005

Publication series

Name	Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Volume	2

Conference

Conference	7th Electronics Packaging Technology Conference, EPTC 2005
Country/Territory	Singapore
City	Singapore
Period	12/7/05 → 12/9/05

ASJC Scopus Subject Areas

General Engineering

Cite this

Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint. / Kumar, Aditya; Chen, Zhong.
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. 2005. p. 873-878 1614522 (Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kumar, A & Chen, Z 2005, Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint. in Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005., 1614522, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005, vol. 2, pp. 873-878, 7th Electronics Packaging Technology Conference, EPTC 2005, Singapore, Singapore, 12/7/05.

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title = "Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint",

author = "Aditya Kumar and Zhong Chen",

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language = "English",

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pages = "873--878",

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note = "7th Electronics Packaging Technology Conference, EPTC 2005 ; Conference date: 07-12-2005 Through 09-12-2005",

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AU - Chen, Zhong

PY - 2005

Y1 - 2005

UR - https://www.scopus.com/pages/publications/33847258347

UR - https://www.scopus.com/pages/publications/33847258347#tab=citedBy

M3 - Conference contribution

AN - SCOPUS:33847258347

SN - 0780395786

SN - 9780780395787

T3 - Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

SP - 873

EP - 878

BT - Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

T2 - 7th Electronics Packaging Technology Conference, EPTC 2005

Y2 - 7 December 2005 through 9 December 2005

ER -

Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Publication series

Conference

ASJC Scopus Subject Areas

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Cite this