Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Aditya Kumar; Zhong Chen

doi:10.1109/TCAPT.2006.886847

Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Aditya Kumar
, Zhong Chen

Nanyang Technological University

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	886-891
Number of pages	6
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	29
Issue number	4
DOIs	https://doi.org/10.1109/TCAPT.2006.886847
State	Published - Dec 2006
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Keywords

Electroless nickel
Interfacial reaction
Metallization
Reliability
Solder
Tensile strength

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10.1109/TCAPT.2006.886847

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title = "Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint",

keywords = "Electroless nickel, Interfacial reaction, Metallization, Reliability, Solder, Tensile strength",

author = "Aditya Kumar and Zhong Chen",

year = "2006",

month = dec,

doi = "10.1109/TCAPT.2006.886847",

language = "English",

volume = "29",

pages = "886--891",

journal = "IEEE Transactions on Components and Packaging Technologies",

issn = "1521-3331",

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T1 - Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

AU - Kumar, Aditya

AU - Chen, Zhong

PY - 2006/12

Y1 - 2006/12

KW - Electroless nickel

KW - Interfacial reaction

KW - Metallization

KW - Reliability

KW - Solder

KW - Tensile strength

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UR - https://www.scopus.com/pages/publications/33947257921#tab=citedBy

U2 - 10.1109/TCAPT.2006.886847

DO - 10.1109/TCAPT.2006.886847

M3 - Article

AN - SCOPUS:33947257921

SN - 1521-3331

VL - 29

SP - 886

EP - 891

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 4

ER -

Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

ASJC Scopus Subject Areas

Keywords

Access to Document

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